Advances in Photodiodes 2011
DOI: 10.5772/15178
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Avalanche Photodiodes in Submicron CMOS Technologies for High-Sensitivity Imaging

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Cited by 28 publications
(5 citation statements)
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“…Using coincidence between vertically aligned SPAD cell pairs is a key aspect because it can dramatically reduce the dark count rate. This is particularly important since, in order to reduce the system complexity and the power consumption, the electronics should be monolithically integrated with SPADs in a CMOS technology, for which it is not easy to obtain SPADs with low dark count figures [26]. In terms of efficiency, encouraging results have been obtained from tests with SiPMs having an active thickness of a few µm [27], but they should be confirmed with CMOS SPADs where the active thickness is even smaller (∼1 µm).…”
Section: Jinst 10 C07010 2 Recent Advances In Planar Pixel Sensorsmentioning
confidence: 99%
“…Using coincidence between vertically aligned SPAD cell pairs is a key aspect because it can dramatically reduce the dark count rate. This is particularly important since, in order to reduce the system complexity and the power consumption, the electronics should be monolithically integrated with SPADs in a CMOS technology, for which it is not easy to obtain SPADs with low dark count figures [26]. In terms of efficiency, encouraging results have been obtained from tests with SiPMs having an active thickness of a few µm [27], but they should be confirmed with CMOS SPADs where the active thickness is even smaller (∼1 µm).…”
Section: Jinst 10 C07010 2 Recent Advances In Planar Pixel Sensorsmentioning
confidence: 99%
“…A p-n junction consisting for example of a n+ diffusion over a p-type substrate cannot be suitable for an avalanche diode because of the curvature at the device edge leading to a local higher electric field and thus causing premature edge breakdown (PEB). In this preliminary work, some PEB prevention techniques found in literature [3][4][5] have been studied by TCAD simulations [6] adopting 2D Cylindrical models and 130nm CMOS process technological data. Simulations results are briefly discussed in the following subsections.…”
Section: Apix Implementation In Standard Cmos Technologymentioning
confidence: 99%
“…Thanks to a low doped p-well surrounding the p+ diffusion the electric field can be successfully smoothed down [3] (figure 1). However this layout may violate the design rules of a standard CMOS process as the intersection of diffusion and well regions, e.g.…”
Section: Low Doped Guard Ringmentioning
confidence: 99%
“…HE performance of CMOS image sensors based on Single Photon Avalanche Diodes (SPADs) has been tremendously improved in the last years [1], [2]. They have been proven for photon counting and Time-of-Flight (ToF) [3].…”
Section: Introductionmentioning
confidence: 99%