Automatic layout design for power module

Ning, Puqi; Wang, Fred; Ngo, Khai D. T.

doi:10.1109/ecce.2010.5617854

Cited by 13 publications

(22 citation statements)

References 18 publications

(21 reference statements)

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“…These analyses are based on models in each domain. Recently, efforts have been pursued to bring these domains together to achieve a degree of design automation for power substrate layouts [90]- [92] some of which involve abstracted models in an optimization framework. As the industry pushes for greater levels of integration additional CAD tools, models, and algorithms will be needed to define a rigorous design flow through which the appropriate analyses are performed to ensure performance, manufacturability, and reliability.…”

Section: E Modeling and Optimizationmentioning

confidence: 99%

Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

Mantooth

Glover

Shepherd

2014

IEEE J. Emerg. Sel. Topics Power Electron.

207

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The current state of wide bandgap device technology is reviewed and its impact on power electronic system miniaturization for a wide variety of voltage levels is described. A synopsis of recent complementary technological developments in passives, integrated driver, and protection circuitry and electronic packaging are described, followed by an outline of the applications that stand to be impacted. A glimpse into the future based on the current technological trends is offered.Index Terms-Gallium nitride (GaN), power electronics, power integrated circuits, power semiconductor devices, silicon carbide (SiC), wide bandgap semiconductors.

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Section: E Modeling and Optimizationmentioning

confidence: 99%

Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

Mantooth

Glover

Shepherd

2014

IEEE J. Emerg. Sel. Topics Power Electron.

207

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“…This leads to some popular floorplan-driven algorithms such as Slicing Tree [16], Polish Expression [28], or Sequence Pairs [21]. Recently, these approaches are also extended to power electronics floorplanning problem, both in 2D [22] and 3D layouts [3], followed by a genetic algorithm for layout optimization.…”

Section: Evaluation Of State Of the Artmentioning

confidence: 99%

PowerSynth progression on layout optimization for reliability and signal integrity

Peng

Razi

et al. 2020

NOLTA

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PowerSynth has been developed to significantly accelerate power module design through a multi-objective layout synthesis and optimization process. It uses a series of layout generation and optimization algorithms and various electrical and thermal models to automatically synthesize power module layouts and create a Pareto surface of solutions with optimum electrical and thermal performance. Recent advanced power modules are designed with various types of components integrated on multiple device layers to minimize the parasitics and increase power density. With more compact layouts and tighter design constraints, power module design becomes increasingly challenging because of reliability and signal integrity issues, such as partial discharge, electromagnetic interference (EMI), electro migration, and noise-induced false turn-on. This paper summarizes the latest PowerSynth layout engine and model improvements with an emphasis on the new reliability and signal integrity features. A generic and scalable constraint-aware layout engine is developed to process generic types of devices, traces, and connectors in power modules. Electrical models are improved from a 1D wire model to a 2D mesh model with enhanced feature sets to better capture the intrinsic layout structures and extract coupling between power and gate loops. EMI models are built on top of it to further reduce the noise analysis and qualification requirement posted on designers. Finally, a new post-layout optimization step is included in the flow as an improvement of design for manufacturability and reliability. The software development along with the hardware testing results demonstrates the latest advances in design automation for power electronics.

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“…This has reduced the number of simulations needed in search of an optimized design. Furthermore, the work in [34] has used strategies borrowed from VLSI work to develop an efficient automated design algorithm. An approach from [35] has shown fast and accurate design by employing reduced order modeling in an optimization loop.…”

Section: Power Module Designmentioning

confidence: 99%

Emerging Trends in Silicon Carbide Power Electronics Design

Mantooth¹

2017

CPSS TPEA

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Abstract-The emergence of wide bandgap power semiconductor devices has opened the possibilities of improved electrical performance and power density. Advanced research into wide bandgap power electronics also includes advances in integrated circuit design, semiconductor device modeling, 3D electronic packaging, and computer-aided design of wide bandgap based electronics. These emerging trends are described along with some early results indicating the additional improvements possible in power density. Operation at extreme temperatures also becomes more feasible.Index Terms-Gallium nitride, power integrated circuits, power semiconductor devices, power electronics, silicon carbide, wide bandgap semiconductors.

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Automatic layout design for power module

Cited by 13 publications

References 18 publications

Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

PowerSynth progression on layout optimization for reliability and signal integrity

Emerging Trends in Silicon Carbide Power Electronics Design

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