2010
DOI: 10.1016/j.surfcoat.2009.09.002
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Atomic-scale mechanisms for diffusion of impurities in transition-metal nitrides

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Cited by 10 publications
(12 citation statements)
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“…Similar interactions with native point defects have been proposed by first-principles calculations for Cu atoms in TiN [12,14].…”
Section: Introductionsupporting
confidence: 79%
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“…Similar interactions with native point defects have been proposed by first-principles calculations for Cu atoms in TiN [12,14].…”
Section: Introductionsupporting
confidence: 79%
“…With these values the diffusion coefficient at 1000 °C was calculated to be about 8×10 -18 cm 2 s -1 . A comparison to theoretical studies [11][12][13][14][15] based on densityfunctional theory shows that the likely diffusion mechanism in the present substoichiometric TiN films is Cu migration from one N vacancy site to another with an activation energy of 2.8 eV and a pre-exponential factor of about 9.7×10 -7 cm 2 s -1 .…”
Section: Relation To Theoretical Studiesmentioning
confidence: 71%
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