Two-dimensional MoS2 is a promising material
for applications,
including electronics and electrocatalysis. However, scalable methods
capable of depositing MoS2 at low temperatures are scarce.
Herein, we present a toolbox of advanced plasma-enhanced atomic layer
deposition (ALD) processes, producing wafer-scale polycrystalline
MoS2 films of accurately controlled thickness. Our ALD
processes are based on two individually controlled plasma exposures,
one optimized for deposition and the other for modification. In this
way, film properties can be tailored toward different applications
at a very low deposition temperature of 150 °C. For the modification
step, either H2 or Ar plasma can be used to combat excess
sulfur incorporation and crystallize the films. Using H2 plasma, a higher degree of crystallinity compared with other reported
low-temperature processes is achieved. Applying H2 plasma
steps periodically instead of every ALD cycle allows for control of
the morphology and enables deposition of smooth, polycrystalline MoS2 films. Using an Ar plasma instead, more disordered MoS2 films are deposited, which show promise for the electrochemical
hydrogen evolution reaction. For electronics, our processes enable
control of the carrier density from 6 × 1016 to 2
× 1021 cm–3 with Hall mobilities
up to 0.3 cm2 V–1 s–1. The process toolbox forms a basis for rational design of low-temperature
transition metal dichalcogenide deposition processes compatible with
a range of substrates and applications.