2nd Annual International IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Biology. Proceedings (Cat. No.
DOI: 10.1109/mmb.2002.1002326
|View full text |Cite
|
Sign up to set email alerts
|

Assessing biocompatibility of materials for implantable microelectrodes using cytotoxicity and protein adsorption studies

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

2
22
0

Publication Types

Select...
6
1
1

Relationship

0
8

Authors

Journals

citations
Cited by 31 publications
(25 citation statements)
references
References 8 publications
2
22
0
Order By: Relevance
“…Electrode material is a key factor in the electrosorption technique. The electrode for electrosorption is required to have high electrical conductivity, large specific surface area and stable electrochemical performance [ 15 ]. Johnson et al .…”
Section: Introductionmentioning
confidence: 99%
“…Electrode material is a key factor in the electrosorption technique. The electrode for electrosorption is required to have high electrical conductivity, large specific surface area and stable electrochemical performance [ 15 ]. Johnson et al .…”
Section: Introductionmentioning
confidence: 99%
“…In the fi eld of imaging, studies have used electron microscopy tools to explore nanoscale features of nerve growth and attachment and rates of bacterial growth on both diverse implant materials and diversely structured implant interfaces (Brors et al 2002 ;Selvakumaran et al 2002 ;Pawlowki et al 2005 ) . Other studies have explored the degradation of implant materials over time, examining rates of degradation and affect on signal transmission between nerve and implant (Mlynski et al 2007 ;Trabandt et al 2005 ) .…”
Section: Visualizing and Structuring Neural Prosthetic Interfacesmentioning
confidence: 99%
“…titanium), non-metals (silicon, glass) and polymers (e.g. polyimide) (Cameron et al, 1998;Fulzele et al, 2003;Malmstrom et al, 1998;Prigent et al, 1998;Quester et al, 2003;Scribner et al, 2003;Selvakumaran et al, 2002). For encapsulating the implant devices, some of these materials must be hermetically joined in similar or dissimilar combinations.…”
Section: Introductionmentioning
confidence: 99%