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Based on previous results of bond strength, scanning electron microscopy(SEM)/energy dispersive spectroscopy (EDS) and x-ray photoelectron spectroscopy (for thin film thickness in the range of 50 to 200 nm range), it is expected for a moderate film thickness of titanium (over 50 nm) for the system of sputtered Ti-coated glass/polymer two factors play important roles in getting strong bond between Ti/Polyimide interface: (i) mechanical interlocking property and (ii) chemical bond formation such as Ti-C, Ti-O between Ti and imidex (PI) film. In this study, a systematic investigation has been conducted to understand the effects of thin films on bond quality and on failure mechanism of the interface between 400 nm sputtered Ti-coated glass/imidex (PI) system. This article basically studies if for this higher film thickness the failure pattern and bond strength are consistent with the previous data. From previous studies (for thin film thickness of 50 to 200 nm) the conclusion extracted is thin film with thickness of less than 50 nm exhibited low bond strength when compared to film thickness over 50 nm and from the results obtained in this study it is concluded that the bond reliability and failure modes of sputtered Ti film on glass are consistent even for a film thickness as high as 400 nm and three types of failure modes are found : (i) cohesive failure mode, (ii) Ti/glass interface failure mode, and (iii) glass failure mode. The roughness value for this coating thickness is 17 nm.
Based on previous results of bond strength, scanning electron microscopy(SEM)/energy dispersive spectroscopy (EDS) and x-ray photoelectron spectroscopy (for thin film thickness in the range of 50 to 200 nm range), it is expected for a moderate film thickness of titanium (over 50 nm) for the system of sputtered Ti-coated glass/polymer two factors play important roles in getting strong bond between Ti/Polyimide interface: (i) mechanical interlocking property and (ii) chemical bond formation such as Ti-C, Ti-O between Ti and imidex (PI) film. In this study, a systematic investigation has been conducted to understand the effects of thin films on bond quality and on failure mechanism of the interface between 400 nm sputtered Ti-coated glass/imidex (PI) system. This article basically studies if for this higher film thickness the failure pattern and bond strength are consistent with the previous data. From previous studies (for thin film thickness of 50 to 200 nm) the conclusion extracted is thin film with thickness of less than 50 nm exhibited low bond strength when compared to film thickness over 50 nm and from the results obtained in this study it is concluded that the bond reliability and failure modes of sputtered Ti film on glass are consistent even for a film thickness as high as 400 nm and three types of failure modes are found : (i) cohesive failure mode, (ii) Ti/glass interface failure mode, and (iii) glass failure mode. The roughness value for this coating thickness is 17 nm.
The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process involves the selection of packaging materials and technology, process design, fabrication, and testing. As the demand of functionalities of an electronic or MEMS device is increasing every passing year, chip size is getting larger and is occupying the majority of space within a package. This requires innovative packaging technologies so that integration can be done with less thermal/mechanical effect on the nearby components. Laser processing technologies for electronic and MEMS packaging have potential to obviate some of the difficulties associated with traditional packaging technologies and can become an attractive alternative for small-scale integration of components. As laser processing involves very fast localized and heating and cooling, the laser can be focused at micrometer scale to perform various packaging processes such as dicing, joining, and patterning at the microscale with minimal or no thermal effect on surrounding material or structure. As such, various laser processing technologies are currently being explored by researchers and also being utilized by electronic and MEMS packaging industries. This paper reviews the current and future trend of electronic and MEMS packaging and their manufacturing processes. Emphasis is given to the laser processing techniques that have the potential to revolutionize the future manufacturing of electronic and MEMS packages.
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