Assessing Aptitude of Plated Ni–W Film as Mold Materials for Borosilicate Glass

Kaneko

Takahashi

et al. 2013

Jpn. J. Appl. Phys.

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We proposed a simple method to fabricate a Ni–W electroformed mold for glass micro-press molding. For example, borosilicate glass (D263) was molded using the Ni–W electroformed mold. A Ni–W electroformed mold with a fine line was fabricated by photolithography and electroforming technology. Additionally, the Ni–W electroformed mold did not require a release layer. As the result of molding D263 at 883 K, the minimum pitch of the glass pattern was the same as that of the Ni–W electroformed mold. We argue that the crystallization of amorphous Ni–W occurred with the activation energy derived from the heating of micro-press molding. The heating temperature was 833 K. Additionally, the release characteristics of a Ni–W film were improved by increasing the percentage of W. In terms of the thermochemical stability and high content rate of W, we indicated that Ni–W electroformed molds can be used repeatedly for glass micro-press molding.

“…%. For the reported Ni-W films, 17,18,22) the content ratio of W in the Ni-W mold was high. Thus, we concluded that Ni-W molds are stable for glass micro-press molding.…”

Section: Glass Press Molding and Physical Property Measurementmentioning

confidence: 90%

“…16) Additionally, we confirmed that the Ni-W electrodeposited film is a chemically stable material for borosilicate glass molding. 17) From these reports, we investigated the property variation of the Ni-W electroformed mold by micro-press molding.…”

Section: Introductionmentioning

confidence: 99%

Property Variation of Ni–W Electroformed Mold for Micro-Press Molding

Kaneko

Takahashi

et al. 2013

Jpn. J. Appl. Phys.

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“…%. 21) Additionally, we showed the usability of Ni-W plating film as mold material of glass imprinting to satisfy the chemical stability, and heat resistance requirements. 22) However, an anomalous microspike called a nodule is easily formed on the Ni-W surface.…”

Section: Introductionmentioning

confidence: 94%

Effect of metal ion concentration in Ni–W plating solution on surface roughness of Ni–W film

Kaneko

Kurouchi

et al. 2015

Jpn. J. Appl. Phys.

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Since nanopatterns are used for various purposes including solar cells, super-hydrophilicity, and biosensors, it is necessary to miniaturize the patterns on glass devices from micro- to nano-order. We have studied glass imprinting as an excellent microfabrication technology for glass devices. Uniformity of the nanopattern height is required for a mold, since a nodular structure on the Ni–W surface is recognized as a problem in Ni–W nanopattern formation. We confirmed that the Ni–W plating bath increasing metal ion concentration is effective for inhibition of the nodular structure on the Ni–W film, and succeeded in Ni–W nano pattern formation with uniform height. However, the W content rate of plated Ni–W film was reduced in exchange for enhancing the flatness of the Ni–W film. It is necessary to examine the Ni–W plating condition for obtaining planarization of the Ni–W surface and a high content rate of W in the Ni–W film.

Fabrication of Ni-W Electroformed Mold for Thermal Imprint of Borosilicate Glass

Kaneko²,

Takahashi³

et al. 2013

Trans.JSME, Ser.A

We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 µm and 3.8 µm, respectively. The thermal imprint for borosilicate glass carried out with Ni-W electroformed mold. The shape of the Ni-W electroformed mold was printed on the borosilicate glass by thermal imprint. The borosilicate glass was removed from the Ni-W electroformed mold easily.