Abstract:We proposed an electroformed mold for thermal imprint of borosilicate glass in this paper. The mold was made of Ni-W electrodeposition film that was superior to heat-resistance and removing glass. The resist pattern for electroforming was fabricated with SU8-10. Ni-W solution for electroforming was developed by mixing nickel sulfamate, tungsten sodium and citric acid. The minimum pitch and the height of the pattern on Ni-W electroformed mold were about 40 µm and 3.8 µm, respectively. The thermal imprint for bo… Show more
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