Assembly automation on the nanoscale

Wich, Thomas; Stolle, Christian; Luttermann, Tim; Fatikow, Sergej

doi:10.1016/j.cirpj.2011.03.003

Cited by 4 publications

(3 citation statements)

References 31 publications

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“…The relative accuracy using these methods has been reported to be in the range of 10 µm [9], where a focus-based method was used for manipulating CNTs. Wich et al implemented a focus-based method for Z-axis coarse adjustments during a nanoassembly task [14]. Ru and To used a similar approach for contact detection and manipulating the nanospheres [12].…”

Section: Introductionmentioning

confidence: 99%

Visual Servoing-Based Depth-Estimation Technique for Manipulation Inside SEM

Marturi¹,

Tamadazte²,

Dembélé³

et al. 2016

IEEE Trans. Instrum. Meas.

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Depth estimation for micro-nanomanipulation inside a scanning electron microscope (SEM) is always a major concern. So far in the literature, various methods have been proposed based on stereoscopic imaging. Most of them require external hardware unit or manual interaction during the process. In this paper, solely relying on image sharpness information, we present a new technique to estimate the depth in real-time. To improve the accuracy as well as the rapidity of the method, we consider that both autofocus and depth estimation as visual servoing paradigms. The major flexibility of the method lies in its ability to compute the focus position and the depth using only the acquired image information i.e., sharpness. The feasibility of the method is shown by performing various ground truth experiments: autofocus achievements, depth estimation, focus-based nanomanipulator depth control and sample topographic estimation at different scenarios inside the vacuum chamber of a tungsten gun SEM. The obtained results demonstrate the accuracy, rapidity and efficiency of the developed method.

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Section: Introductionmentioning

confidence: 99%

Visual Servoing-Based Depth-Estimation Technique for Manipulation Inside SEM

Marturi¹,

Tamadazte²,

Dembélé³

et al. 2016

IEEE Trans. Instrum. Meas.

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“…This progress has turned the SEM into an extraordinary tool to develop more complex and realistic in situ experiments, achieving even at the subnanometer scale". In the near future, new SEM imaging modes, nanomanipulation and nanofabrication technologies (Miller & Russell, 2007 ;Romano-Rodriguez & Hernandez-Ramirez, 2007 ;Wich et al, 2011) will make possible to replicate more closely the conditions as the ones associated to the problems to be treated. In situ ESEM will probably be used to overcome technical and fundamental challenges in many scientific domains.…”

Section: Discussionmentioning

confidence: 99%

In Situ Experiments in the Scanning Electron Microscope Chamber

Podor¹,

Ravaux²,

Brau³

2012

Scanning Electron Microscopy

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“…Instead, adhesive bond handling uses a carrying end effector, to which the carried object is attached. The adhesive force between carrier and carried object can be the van der Waals force, or an actual adhesive bonding between them, or a welded deposition (Wich et al, 2009). Last to mention, the direct handling of nanoscale objects with the tip of an AFM is a further interesting handling approach.…”

Section: Introductionmentioning

confidence: 99%

Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires

Fatikow

Bartenwerfer

2012

International Journal of Intelligent Mechatronics and Robotics

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Presented is a new experimental implementation for well-directed handling of silicon nanowires with diameters of less than 100 nm and length of up to 10 µm. Handling device is a robotic setup of several centimeters in size and nanometer accuracy, mounted inside a SEM (Scanning Electron Microscopy) chamber. The actual transfer of the nanowires is done by this setup from a production substrate to a different electrode substrate by using an STM (Scanning Tunneling Microscope) tungsten tip as carrier, gas based adhesive bonding, and FIB (Focused Ion Beam) assisted milling. The goal of this series is the placement on the electrodes in order to facilitate further electrical characterization measurements. The presented handling technique for nanoscale objects facilities an accurate picking and placing of individual nanowires on the one hand and a transfer over several centimeters to a complete different substrate on the other hand. Advantages, prospects and limits are investigated particularly with regard to a handling automation for applications.

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Assembly automation on the nanoscale

Cited by 4 publications

References 31 publications

Visual Servoing-Based Depth-Estimation Technique for Manipulation Inside SEM

Visual Servoing-Based Depth-Estimation Technique for Manipulation Inside SEM

In Situ Experiments in the Scanning Electron Microscope Chamber

Nanorobot-Based Handling and Transfer of Individual Silicon Nanowires

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