Artificial porous structure: An effective method to improve thermoelectric performance of Bi2Te3 based alloys

Hu, Xiaoming; Hu, Jie; Fan, Xi’ an; Feng, Bo; Pan, Zhao; Liu, Peihai; Zhang, Yanglin; Li, Rusong; He, Zhu; Li, Guangqiang; Li, Yawei

doi:10.1016/j.jssc.2019.121060

Cited by 18 publications

(8 citation statements)

References 24 publications

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“…The highest value is 7.0 mW m –1 K –2 , obtained in the sample under 773 K/35 MPa (Figure c). It is comparable to or even higher than the previously reported Cu–Ni-based values. ,,, It is noted that the highest porosity (25.2%) in the 673 K/15 MPa sample in our work does not deteriorate the power factor as happened before, , and still maintains the high value around 4.1 mW m –1 K –2 comparable to the counterparts in previous studies, as shown in Table S4.…”

Section: Resultssupporting

confidence: 90%

“…It is comparable to or even higher than the previously reported Cu−Ni-based values. 21,29,32,36 It is noted that the highest porosity (25.2%) in the 673 K/15 MPa sample in our work does not deteriorate the power factor as happened before, 60,61 and still maintains the high value around 4.1 mW m −1 K −2 comparable to the counterparts in previous studies, as shown in Table S4. The resultant zT increases when temperature increases, as shown in Figure 7a.…”

Section: ■ Results and Discussionsupporting

confidence: 88%

“…To illustrate the effect of pores on heat transportation, according to the effective medium theory, − the thermal conductivity model of porous bulks can be expressed as where κ s is the thermal conductivity of a Cu 70 Ni 30 skeleton, φ is the fraction of pores, and κ bulk is the thermal conductivity of the pure dense counterpart, which is around 32 W m –1 K –1 at 323 K of the pristine bulk Cu 70 Ni 30 in this work. The results are shown in Table .…”

Section: Resultsmentioning

confidence: 99%

See 2 more Smart Citations

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Jia

Zhong

et al. 2022

ACS Appl. Energy Mater.

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A Cu–Ni-based alloy with a high power factor is a commercially utilized metallic thermocouple material. However, the high thermal conductivity has been a major limitation to achieving thermoelectric performance in semiconductor materials. Herein, this work presents a 76.1% reduced thermal conductivity (∼7.7 W m–1 K–1) in Cu70Ni30, which is one of the lowest reported values in the literature. Such suppression of thermal conductivity can be attributed to the varied frequency phonon scattering by the interfacial potential barrier, built from micron-scale defects formed via sintering melt-spun ribbons. However, the defects simultaneously reduce the charge carrier concentration, mobility, and thus the electrical conductivity. The lowest thermal conductivity leads to the highest zT and ZT avg in the sample sintered at 673 K under 15 MPa. The values are 0.24 (@573 K) and 0.15 (323–573 K), respectively, which are 130.3 and 140.0% higher than the values of the pristine counterpart. Our work demonstrates that improved thermoelectric performance in Cu–Ni-based alloys can be obtained by creating various interfacial defects even at micron scales, which paves the way to suppress thermal conductivity largely in metallic thermoelectric materials via melt-spinning (MS) and spark plasma sintering (SPS) synthesis.

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Section: Resultssupporting

confidence: 90%

Section: ■ Results and Discussionsupporting

confidence: 88%

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Jia

Zhong

et al. 2022

ACS Appl. Energy Mater.

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“…Manufacturing porous specimens improves TE properties in Bi 2 Te 3 -based alloys at the expense of the stability and mechanical properties. The homogeneous pores in Bi 0.4 Sb 1.6 Te 3 were produced by introducing and decomposing NH 4 HCO 3 . The reduction of κ by ∼15% can compensate for a ∼7% deterioration in σ, resulting in a zT value of ∼1.11 at 343 K. The Vickers hardness, however, was reduced to 40.8 HV, compared to 51.71 HV of samples without pores.…”

Section: The Minimization Of Lattice Thermal Conductivitymentioning

confidence: 99%

Comprehensive Insight into p-Type Bi₂Te₃-Based Thermoelectrics near Room Temperature

Shi

Zhao

et al. 2022

ACS Appl. Mater. Interfaces

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Bi2Te3 is a well-recognized material for its unique properties in diverse thermoelectric applications near room temperature. The considerable efforts on Bi2Te3-based alloys have been extremely extensive in recent years, and thus the latest breakthroughs in high-performance p-type (Bi, Sb)2Te3 alloys are comprehensively reviewed to further implement applications. Effective strategies to further improve the thermoelectric performance are summarized from the perspective of enhancing the power factor and minimizing the lattice thermal conductivity. Furthermore, the surface states of topological insulators are investigated to provide a possibility of advancing (Bi, Sb)2Te3 thermoelectrics. Finally, future challenges and outlooks are overviewed. This review will provide potential guidance toward designing and developing high-efficient Bi2Te3-based and other thermoelectrics.

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“…Compared with its bulk counterparts, nanostructured Bi 2 Te 3 film provides promising possibilities for enhanced TE properties and potential applications in micro/nanoelectromechanical systems (MEMS/NEMS) TE device [8]. The thermoelectric performance of Bi 2 Te 3 can be optimized by adjusting the (00l) orientation [9,10], pores [9,11], nanosheet boundary [12,13], and the intrinsic defects [14,15]. In addition, constructing a heterogeneous interface is also one of the effective methods to optimize the thermoelectric performance.…”

Section: Introductionmentioning

confidence: 99%

Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures

Zhang

Liu

et al. 2021

Micromachines

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The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al2O3/Bi2Te3 heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor. The introducing metals can be alloyed with Bi2Te3 or form interstitials or dopants to adjust the carrier concentration and mobility. In addition, the metal-semiconductor interface as well as the metal-insulator-semiconductor interface constructed by the introduced metal and Al2O3 would further participate in the regulation of the carrier transport process. By adjusting the metal and oxide layer, it is possible to realize the simultaneous optimization of electric conductivity and Seebeck coefficient. This work will enable the optimal and novel design of heterostructures for thermoelectric materials with further improved performance.

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Artificial porous structure: An effective method to improve thermoelectric performance of Bi2Te3 based alloys

Cited by 18 publications

References 24 publications

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Comprehensive Insight into p-Type Bi₂Te₃-Based Thermoelectrics near Room Temperature

Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures

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Artificial porous structure: An effective method to improve thermoelectric performance of Bi2Te3 based alloys

Cited by 18 publications

References 24 publications

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Multi-Interface-Induced Thermal Conductivity Reduction and Thermoelectric Performance Improvement in a Cu–Ni Alloy

Comprehensive Insight into p-Type Bi2Te3-Based Thermoelectrics near Room Temperature

Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures

Contact Info

Product

Resources

About

Comprehensive Insight into p-Type Bi₂Te₃-Based Thermoelectrics near Room Temperature