Approaches to rapid resist spreading on dispensing based UV-NIL

Usuki, Kazuyuki; Wakamatsu, Satoshi; Oomatsu, Tadashi; Kodama, Keita; Kodama, Kunihiko

doi:10.1117/12.879200

Cited by 14 publications

(11 citation statements)

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“…The fluorinated monomer had an acrylate group that reacts with the acrylate resin upon UV radiation. To study the release property, a fluorine anti-sticking agent was used instead of a fluorine monomer [24][25][26]. Several kinds of acrylate monomer were used to investigate the elastic modulus of the resist.…”

Section: Experimental 21 Materialsmentioning

confidence: 99%

Design of Release Interface for UV-NIL Material

Usuki

Goto

2016

J. Photopol. Sci. Technol.

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Release interface between UV-NIL resists and quartz mold was investigated focusing on surface energy and elastic modulus of resist film in order to improve release property of UV-NIL process. The resist with fluorine monomer and with non-reactive fluorine anti-sticking agent were compared by separation force measurements and surface analyses of release interface. The results indicated that resist design has the capability to both reduce the separation force and maintain a clear mold surface. The mold release agent decomposed with increasing number of imprint shots, but the low release force resist with non-reactive anti-stacking agent was able to control the degradation of mold release agent and thus improve release property endurance. In addition, resists with various acrylate monomer structures and formulations were studied in terms of elastic modulus of UV cured resist film. It is found that the separation force can also be controlled by resist elastic modulus without depending on the effect of anti-sticking agent.

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Section: Experimental 21 Materialsmentioning

confidence: 99%

Design of Release Interface for UV-NIL Material

Usuki

Goto

2016

J. Photopol. Sci. Technol.

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“…[38][39][40] 2 Experimental Methodology In this study, a newly developed NIL resist was investigated. The resist was a mixture of an acrylate monomer, fluorine acrylate monomer, and the initiator.…”

Section: Clean Process Capabilitymentioning

confidence: 99%

“…The throughput issue should be discussed separately. 38 Resist pattern formability was investigated by comparing several resists that had different monomer structures. Figure 6 shows cross-sectional SEM images of imprinted resist patterns.…”

Section: Pattern Formabilitymentioning

confidence: 99%

Design considerations for ultraviolet-nanoimprint lithography resists

Usuki

Wakamatsu

Oomatsu

et al. 2012

J. Micro/Nanolith. MEMS MOEMS

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Design considerations for ultraviolet-nanoimprint lithography resists were investigated focusing on the major issues of ink-jetting performance, pattern formability, release property, and dry etching resistance. Regarding ink-jetting performance, small droplet ink-jetting of 0.7 pl was successfully demonstrated by adjusting the resist fluid property to the ink-jet coater and controlling the resist volatilization. Regarding pattern formability, a resist pattern was imprinted from a mold pattern of 28 nm in width and 60 nm in depth without pattern dimension change. It was thought that modulus control of the resist was more important than resist shrinkage in achieving excellent pattern formability. As for release property, resist with fluorine monomer and with nonreactive fluorine antisticking agent were compared. The results indicated that resist design has the capability to both reduce separation force and maintain a clear mold surface. The mold release agent decomposed with an increasing number of imprint shots, but the low release-force resist with nonreactive antisticking agent was able to control degradation of the mold release agent and thus improve release property endurance. Regarding etching resistance, it was found that increasing the ring parameter of resist is essential for high etching resistance, and resulted in improved etched pattern features of the substrate.

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“…However, when UV nanoimprint is carried out in air, the low pressing pressure causes formation of air bubble defects [10,11] which are not encountered in thermal nanoimprint that employs a high pressing pressure [8]. Application of vacuum ambience solves the problem [12,13] but not without sacrificing the cost-effectiveness of nanoimprint. Therefore, the air bubble defects should be addressed under non-vacuum conditions.…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the air bubble defects should be addressed under non-vacuum conditions. Use of resin droplets in helium ambience [13,14] is proposed as a viable solution in S-FIL [15] (later renamed as J-FIL [16]), where resin droplets merge each other [17] preventing helium from being trapped during molding process; although small amounts of trapped helium bubbles left behind are dissolved in the photo-curable resin. This method works well but it is not compatible to uniformly pre-coated UV curable resins prepared by spin-coating [18].…”

Section: Introductionmentioning

confidence: 99%

Breakthrough Achievement In Nanoimprint Lithography Using PFP Condensable Gas

Matsui

Hiroshima

Hirai

et al. 2014

J. Photopol. Sci. Technol.

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The effectiveness of condensable gas, used as ambience, in UV nanoimprint lithography has been demonstrated. Bubble defect problem, which is inherent in UV nanoimprint under non vacuum ambience, can be solved by PFP condensable gas. UV nanoimprint lithography using PFP was validated for 45 nm pattern fabrication under thin residual layer conditions, which are required for UV nanoimprint used as UV nanoimprint lithography. PFP reduces the viscosity and demolding force of UV curable resins. These properties are helpful in increasing the throughput and reliability of UV nanoimprint. PFP occasionally produces large shrinkages, and degrades pattern quality depending on UV curable resin. These drawbacks can be mitigated by selecting UV curable monomers with a low PFP absorption. In the end, we have demonstrated the satisfied LER and LWR values requested in 22 nm node NAND flash memories and 20,000 repeated imprints with a single mold by UV nanoimprint using PFP.

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Approaches to rapid resist spreading on dispensing based UV-NIL

Cited by 14 publications

References 0 publications

Design of Release Interface for UV-NIL Material

Design of Release Interface for UV-NIL Material

Design considerations for ultraviolet-nanoimprint lithography resists

Breakthrough Achievement In Nanoimprint Lithography Using PFP Condensable Gas

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