Applications

Licari, James J.; Swanson, Dale W.

doi:10.1016/b978-1-4377-7889-2.10005-1

Cited by 10 publications

(6 citation statements)

References 7 publications

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“…ECAs, which provide the electrical connection, mechanical bond, and thermal conduction functions, have been widely used in many applications such as electronic component mounting, 25,26) and three-dimensional (3D) stacking of microelectromechanical system (MEMS) devices. 27,28) In this work, a bonding approach that relies on the surface tension of a droplet of a conductive adhesive is proposed for EEL stacking.…”

Section: Height-control Stacking Approach Based On Ecamentioning

confidence: 99%

A method enabling height-control of chips for edge-emitting laser stacking

Thanh¹,

Ma²,

Amano³

et al. 2015

Jpn. J. Appl. Phys.

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In this paper we present a stacking method that enables the mounting of edge-emitting laser (EEL) devices at compulsory positions for feeding a coupling waveguide at a low temperature, i.e., 110 °C. Bonding laser chips are integrated to an interposer with embedded waveguides using an electrically conductive adhesive (ECA), i.e., silver-filled epoxy resin that relied on the surface tension phenomenon. A simple dispensing technique based on the capillary effect was used to generate adhesive droplets for bonding purposes. The ability to control the bonding height from 3 to 25 µm was demonstrated. While the post-bond in-plane offsets of the bonding EEL chip are determined by the accuracy of the bonder (i.e., within 2 µm range), the bonding height can be engineered, with a deviation within 1 µm, by balancing the external bonding forces with the surface tension of a certain adhesive volume. The reliability of the bond, i.e., bond strength of 106 gf, and heat dissipation function of the ECA, were also validated. The results obtained in this work imply that the use of this low-temperature, height-controllable approach for the stacking of EEL continues to look highly promising.

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Section: Height-control Stacking Approach Based On Ecamentioning

confidence: 99%

A method enabling height-control of chips for edge-emitting laser stacking

Thanh¹,

Ma²,

Amano³

et al. 2015

Jpn. J. Appl. Phys.

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“…As a special kind of adhesives, electrically conductive adhesives (ECAs) can offer both a strong bonding effect as well as desirable electrical conductivity, 6,7 and therefore have significantly advanced in many conductive connection areas such as industrial plant joints, microelectronic packaging, and medical device adhesions 8–11 . In particular, the advanced bonding technology provided by ECAs can replace some laggard spot‐welding operations 3,12 in which high welding temperatures 13 are needed and undesired oxides 14 are formed. It is no doubt that ECAs will make more and greater contributions than ever before in our life.…”

Section: Introductionmentioning

confidence: 99%

Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives

Zhang,

Tang,

Jiang

et al. 2024

Polymer Composites

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Polyacrylate‐based electrically conductive adhesives (PA‐based ECAs) have attracted much attention due to their wide applications in precise instruments and consumer electronics. To obtain high‐performance and environmentally friendly PA‐based ECAs, their main properties and corresponding mechanisms to performance, chemical constitutions and structure–function relationships should be well understood, and the applications of recent PA‐based ECAs should be comprehensively summarized. This review focuses on the progress of PA‐based ECAs in the past two decades and discusses the featured properties, preparation of PA, the selection of conductive fillers and the adhibition of the ECAs. The aim of the review is to find the challenges of high‐performance ECAs and offer some measures and foresee their future development.Highlights Preparation methods of polyacrylate (PA)‐based composites are presented. Properties of PA‐based electrically conductive adhesives (ECAs) are outlined. Selection of conductive fillers and the adhibition of ECAs are discussed. Representative applications of PA‐based ECAs are exhibited. Present main challenges and future solutions are highlighted.

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“…[ 1–7 ] This combination of properties makes them highly attractive for manufacturing of hot‐section components, ablative armor, radomes for aerospace and military industry, high‐speed circuits for microelectronics industry, and structural parts for high‐speed vehicles. [ 8–11 ] Detailed surveys of the cyanate resins properties and applications are given in several review articles. [ 4,11–13 ]…”

Section: Introductionmentioning

confidence: 99%

Cyanate Ester Polymerization: Overview of Mechanistic and Kinetic Aspects

Galukhin

Vyazovkin

2022

Macro Chemistry & Physics

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This article reviews both time-honored and most recent studies of the mechanisms and kinetics of cyanate esters polymerization. Different types of processes, including catalytic, non-catalytic, bulk, solution, and nanoconfined ones are covered. The mechanistic and empirical models suitable for describing the kinetic and diffusion regimes of polymerization are discussed at length. Recent advances in methodology of the analysis of multistep polymerization reactions by means of model-fitting and isoconversional techniques are considered as applied to cyanate esters. The importance of the calorimetric measurements in polymerization studies is emphasized.

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Applications

Cited by 10 publications

References 7 publications

A method enabling height-control of chips for edge-emitting laser stacking

A method enabling height-control of chips for edge-emitting laser stacking

Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives

Cyanate Ester Polymerization: Overview of Mechanistic and Kinetic Aspects

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