Abstract:In this paper we present a stacking method that enables the mounting of edge-emitting laser (EEL) devices at compulsory positions for feeding a coupling waveguide at a low temperature, i.e., 110 °C. Bonding laser chips are integrated to an interposer with embedded waveguides using an electrically conductive adhesive (ECA), i.e., silver-filled epoxy resin that relied on the surface tension phenomenon. A simple dispensing technique based on the capillary effect was used to generate adhesive droplets for bonding … Show more
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