Abstract:In the development of promising ULIS scaling technologies, one of the key roles is played by porous dielectrics with a low permittivity used to isolate interconnects in a metallization system. Condensation of gaseous products in the pores of such films makes it possible to solve the most important problem that prevents the integration of such films, to carry out low-damage plasma etching. However, methods for studying porosity are also based on the study of the adsorption isotherm during condensation in film p… Show more
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