2014
DOI: 10.1016/j.tsf.2014.02.085
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Application of NiMoNb adhesion layer on plasma-treated polyimide substrate for flexible electronic devices

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Cited by 10 publications
(4 citation statements)
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“…31,32) It is known that plasma treatment decreases the number of C-C bonds of the benzene constituting the PI and increases the number of imide groups or carbonyl groups of N-C=O. 33,34) In this inward plasma treatment, the number of C-C single bonds changed little. It is plausible that the increase in N-C=O bonds contributed to the increase in the number of C=O double bonds (carbonyl groups) as observed by the increase in the peak area corresponding to C=O double bonds in the O 1s region spectra.…”
Section: Surface Chemistry Analysismentioning
confidence: 98%
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“…31,32) It is known that plasma treatment decreases the number of C-C bonds of the benzene constituting the PI and increases the number of imide groups or carbonyl groups of N-C=O. 33,34) In this inward plasma treatment, the number of C-C single bonds changed little. It is plausible that the increase in N-C=O bonds contributed to the increase in the number of C=O double bonds (carbonyl groups) as observed by the increase in the peak area corresponding to C=O double bonds in the O 1s region spectra.…”
Section: Surface Chemistry Analysismentioning
confidence: 98%
“…It was established that the C-C single bond contributed to the 287 eV peak while the C-O single bond contributed to the 289 eV peak and the N-C=O bond contributed to the 291 eV peak 31,32). It is known that plasma treatment decreases the number of C-C bonds of the benzene constituting the PI and increases the number of imide groups or carbonyl groups of N-C=O 33,34). In this inward plasma treatment, the number of C-C single bonds changed little.…”
mentioning
confidence: 99%
“…This can be achieved by creating an interposed layer at the interface via plasma and ion beam treatment of the polymer film. 20,25,[27][28][29][30][31][32] In these studies, the substantial enhancement of the adhesion of PMDA-ODA on Cu was found to be achieved by irradiating the PMDA-ODA film with reactive oxygen plasma and ion beam, in contrast to that using only an inert Ar plasma and ion beam treatment. 31,33 The overall improved adhesion was attributed to the presence of oxygen atoms near the PMDA-ODA/Cu interface.…”
Section: Introductionmentioning
confidence: 99%
“…[9][10][11] The PI lm with high temperature resistance, colorless and transparent characteristics can be used as coating, protective layer, exible displays and transparent circuit boards, etc. [12][13][14][15][16] Moreover, there has been a growing interest in functional PI lm materials. [17][18][19][20] For instance, photoluminescence PI has attracted researchers' interest because of its unique luminescence properties.…”
Section: Introductionmentioning
confidence: 99%