An InGaAs/GaAsP strain-compensated layer has been proposed as a base material for GaAs-based double heterojunction bipolar transistors (DHBTs). As known, decreasing bandgap energy of the base layer in heterojunction bipolar transistors (HBTs) can result in a smaller turn-on voltage. Using InGaAs as a base material is one possible approach to achieve the aim. However, compressive strain induced by InGaAs diminishes the influence of indium-adding-induced bandgap energy reduction, and thus abates the advantage of turn-on voltage reduction. In this study, a 280 Å GaAs 0.81 P 0.19 layer has been inserted below the In 0.054 Ga 0.946 As base layer to compensate the compressive strain induced by the InGaAs base layer. The result shows that the utilization of an InGaAs/GaAsP strain-compensated layer results in a reduction of the turn-on voltage by 20 mV. A turn-on voltage reduction of 190 mV over a conventional HBT with a GaAs base layer is achieved by utilizing the In 0.054 Ga 0.946 As/GaAs 0.81 P 0.19 strain-compensated base layer. This particular DHBT has a small offset voltage of 55 mV and a knee voltage of 0.6 V. A peak current gain of 58.98, a unity-current-gain cut-off frequency f T of 22 GHz and a unilateral power gain cut-off frequency f MAX of 25 GHz are also achieved for this particular DHBT.