This Symposium on Spreading Resistance measurements was held on June [13][14] 1974 This technique which has seen rapidly increasing interest and use over the last 10 )r more years, has noteworthy versatility for profiling dopant concentrations over many jrders of magnitude in multiple layer semiconductor structures. Nevertheless, the ever in-:reasing demand on all measurement methods, caused by device fabrication utilizing active regions often less than 1 ym in thickness, taxes the theory, practice and successful applization of all techniques, including the electrical spreading resistance.It is hoped that this symposium, by illustrating the successful applications which lave been made of the technique, and by indicating some of the areas where limitations iiave been found to exist, will encourage further effort by interested parties, to find solutions to those limitations. ' Finally, by compiling a store of well documented measurement practice in one volume, ]lt is hoped that the beginner in this technique will find rapid solutions to possible lasic problems, so that he too may make rapid and successful use of this technique. 13-14, 1974. This Symposium covered the state of the art of the theory, practice and applications of the electrical spreading resistance measurement technique as applied to characterization of dopant density in semiconductor starting materials and semiconductor device structures. In addition to the presented papers, the transcripts of the discussion sessions which were held directly after the Theory, Practice and Applications sessions are also included. These transcripts, which were reviewed by the respective respondents for clarity, are essentially as presented at the symposium.Key words: Dopant concentration, dopant profiles, metal-semiconductor contacts, resistivity, semiconductor surface preparation, silicon, spreading resistance. And here again we find ourselves working closely with ASTM which can so effectively provide an avenue to accomplishing these NBS aims, aims which are, of course, common to thos of ASTM's Committee on Electronics.Our Program now encompasses work on selected measurements, ranging from those needed to characterize silicon and oxides and interface states, through those for photolithography, process control using test structures, bonding and die attachment, and hermeticity; on to thermal and electrical properties of finished devices. And we report our output not only through ASTM but through many other channels including a special series of NBS publications with which many of you are familiar. The technique is based on measurement of the "spreading resistance" or "constriction resistance" of small-area metal-semiconductor pressure contacts.It is currently in wide use in mapping inhomogeneities in silicon crystals and in obtaining thickness profiles of many of the diffused, epitaxial and ion-implanted layers produced during semiconductor device processing.Small area metal-semiconductor pressure contacts are historically somewhat loosely called "point" conta...