Anisotropic Conductive Adhesives for Flip-Chip Interconnects

Abstract

Anisotropic conductive adhesive films consist of an epoxy adhesive with dispersed conductive particles. They are used as electrical-mechanical interconnecting materials for flip-chip to flexible substrates and flipchip to glass substrates. Contact resistance and adhesion strength are two important features of anisotropic conductive adhesive film joints. Contact resistance is affected by the curing degree of the adhesive, the bump characteristics, the reflow process and the environmental application conditions. Adhesion strength is affected by bonding temperature, bonding pressure, bubbles in the joints and particle characteristics. To assess reliability, anisotropic conductive adhesive film joints were tested under thermal cycling tests, autoclave tests and mechanical shock tests.  Koninklijke Brill NV, Leiden, 2008

Flexible Interconnects for Electronic Textiles

“…The bonding process of ACAs involves application of both pressure and temperature simultaneously. During this process, the adhesive resin is squeezed out of the way whereas a single layer of the conducting particles is trapped between the substrates being connected -resulting in conduction in the direction of the applied pressure [189,190] . ACAs are advantageous because they can provide electrical connections only at specific places without connecting other components electrically.…”