2009
DOI: 10.1016/j.microrel.2008.12.011
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Analytical analysis of nanoscale multiple gate MOSFETs including effects of hot-carrier induced interface charges

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Cited by 77 publications
(18 citation statements)
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“…This MOSFET can be used as the RF switch for selecting the data streams from antennas for both the transmitting and receiving processes [45,[92][93][94]. We have emphasized on the basics of the circuit elements (e.g., drain current, threshold voltage, resonant frequency, resistances at switch-ON condition, capacitances, energy stored, cross talk, and switching speed) required for the integrated circuit of the radio-frequency subsystem of the CSDG RF CMOS device and role of these basic circuit elements is also discussed [95][96][97]. However, various properties demonstrated by the switch, due to the cylindrical surrounding double-gate MOSFET, have been discussed in this book.…”
Section: Cylindrical Surrounding Double-gate Mosfetmentioning
confidence: 99%
“…This MOSFET can be used as the RF switch for selecting the data streams from antennas for both the transmitting and receiving processes [45,[92][93][94]. We have emphasized on the basics of the circuit elements (e.g., drain current, threshold voltage, resonant frequency, resistances at switch-ON condition, capacitances, energy stored, cross talk, and switching speed) required for the integrated circuit of the radio-frequency subsystem of the CSDG RF CMOS device and role of these basic circuit elements is also discussed [95][96][97]. However, various properties demonstrated by the switch, due to the cylindrical surrounding double-gate MOSFET, have been discussed in this book.…”
Section: Cylindrical Surrounding Double-gate Mosfetmentioning
confidence: 99%
“…These hot-carriers result from the impact of ionization in the channel near the drain junction, which subsequently are injected into the gate oxide and give rise to a localized and non-uniform pileup of interface states and oxide charges near the drain-channel junction [6,7]. The main cause of the hot-carrier degradation effect in the conventional bulk MOSFETs and multigate MOSFETs for subthreshold regime is already discussed in many works [6][7][8][9]. Therefore, in order to get a global view of DG MOSFET performances under damage conditions, compact analytical current-voltage (I-V) approaches are indispensables not only in compact modeling but also for the comprehension of the fundamentals of such device characteristics.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, we have studied SCEs in DG MOSFETs including interfacial traps effects by deriving a simple analytical approach for the channel potential in weak inversion regime [8]. Based on this subthreshold behavior analysis including the traps effects, in the present paper, an accurate analytical one-dimensional drain current model including the interfacial hot-carrier effects, after considering the step-function approximation [8,9] for interface charge distribution, is proposed to explain the immunity of the long channel DG MOSFETs design against the hot-carrier effects.…”
Section: Introductionmentioning
confidence: 99%
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“…A direct way to improve the high frequency and scaling capabilities of the GaN-MESFET is the reduction of its gate length [8]. However, with the reduction in channel length, control of short-channel effects (SCEs) and drain current in subthreshold regime is one of the biggest challenges in further downscaling of the technology [9,10]. The shortchannel effects can be exactly analyzed by numerical simulation, based on a full set of semiconductor device equations or by Monte Carlo simulation [11].…”
mentioning
confidence: 99%