Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407)
DOI: 10.1109/ict.1999.843396
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Analysis on thermo-mechanical stress of thermoelectric module

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Cited by 7 publications
(4 citation statements)
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“…For example, in ref. [11], experiments using 47.5 mm x 47.5 mm TEGs with 49 thermoelements showed that TEGs with larger area pellets display a slower rate of degradation. In ref.…”
Section: Failure Mechanismsmentioning
confidence: 98%
See 1 more Smart Citation
“…For example, in ref. [11], experiments using 47.5 mm x 47.5 mm TEGs with 49 thermoelements showed that TEGs with larger area pellets display a slower rate of degradation. In ref.…”
Section: Failure Mechanismsmentioning
confidence: 98%
“…Experimental investigations of standard TEGs typically involve a sample placed between a heat source and sink with the cold side of the TEG maintained at a constant temperature and the hot side temperature cycled, such as the study by Chen and Lee [10]. Hori et al [11] assessed the influence of thermal cycling on the performance of bismuth telluride (Bi2Te3) TEGs. Three modules were investigated, each consisting of thermoelectric elements with a different cross-sectional area.…”
Section: Introductionmentioning
confidence: 99%
“…A 16% increase in module resistivity, attributed to cracking and interdiffusion at the solder-metal interface, resulted in the zT decreasing from 0.74–0.63 [67]. A finite element model of a Bi 2 Te 3 module by Hori et al, where the hot side was cycled between 30 and 180 o C while the cold side remained at 30 °C, predicts an increase in the internal resistance caused by the contact degradation in the Sn-Pb solder present between the Cu conducting plate and the TE element (Bi 2 Te 3 ), with failure of the module after 400 cycles [68]. Stresses at the solder-Bi 2 Te 3 interface were tensile in nature, with a peak value of 142 MPa.…”
Section: Stresses and Strains In Te Modulementioning
confidence: 99%
“…Moreover, continuous thermal cycling and an elevated temperature difference generate thermal stress into the TEG module, which affects the thermoelectric performance and may eventually lead to structural and mechanical failures . The device element cross-sectional area, mismatch of the coefficient of thermal expansion (CTE), and device geometry influence the thermomechanical stability as well as the lifetime of the TEG. A comprehensive study on the impact of geometrical parameters on thermal stress has shown that a thinner alumina plate as a heat collector (thickness ≤ 2.5 mm) and a smaller gap between thermoelectric legs can efficiently reduce the thermal stress generated in a Bi 2 Te 3 -based TEG …”
Section: Introductionmentioning
confidence: 99%