Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement

Seok, Seonho; Park, Hyung Dal; Choi, Wonsuk; Kim, Ockchul; Kim, Jinseok

doi:10.1109/dtip.2019.8752695

“…Poisson ratio of the scotch tape is assumed to be 0.4 as other polymer materials. Young's modulus and poisson ratio of parylene are 2.67 GPa, as extracted in previous work, and 0.4, respectively [23]. Table 3 summarizes material properties for the FEM model.…”

Section: Fem Modeling and Simulationmentioning

confidence: 90%

“…FEM modeling and simulation is very useful to understand stress effect and corresponding deformation of MEMS package, debonding characteristics of a transfer packaging, and mechanical behaviors related with delamination [23][24][25][26][27]. Especially, debonding of a substrate and film delamination can be studied by adopting a CZM (Cohesive Zone model) to represent the interface of interest [28][29][30].…”

Section: Fem Modeling and Simulationmentioning

confidence: 99%

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Seok

¹

,

Park

²

,

Kim

³

2020

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This paper presents measurement and FEM (Finite Element Method) analysis of metal adhesion force to a parylene substrate for implantable neural probe. A test device composed of 300 nm-thick gold and 30 nm-thick titanium metal electrodes on top of parylene substrate was prepared. The metal electrodes suffer from delamination during wet metal patterning process; thus, CF4 plasma treatment was applied to the parylene substrate before metal deposition. The two thin film metal layers were deposited by e-beam evaporation process. Metal electrodes had 200 μm in width, 300 μm spacing between the metal lines, and 5 mm length as the neural probe. Adhesion force of the metal lines to parylene substrate was measured with scotch tape test. Angle between the scotch tape and the test device substrate changed from 60° to 90° during characterization. Force exerted the scotch tape was recorded as the function of displacement of the scotch tape. It was found that a peak was created in measured force-displacement curve due to metal delamination. Metal adhesion was estimated 1.3 J/m2 by referring to the force peak and metal width at the force-displacement curve. Besides, the scotch tape test was simulated to comprehend delamination behavior of the test through FEM modeling.

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“…Material properties of the scotch tape have been found by using conventional tensile test as in Ref. [16]. Elastic modulus 6.9 MPa of the scotch tape has been obtained from the slope of linear fit of the stress-strain curve.…”

Section: Sample Preparationmentioning

confidence: 99%

“…A 2D FEM model has been used because it is more efficient than 3D one for surface wrinkling simulation in terms of simulation time. Material properties of the scotch tape have been found by using conventional tensile test as in [17]. Elastic modulus 6.9 MPa of the scotch tape has been obtained from the slope of linear fit of the stress-strain curve.…”

Section: Fem Simulationsmentioning

confidence: 99%

Scotch-tape surface wrinkling based thin-film material properties extraction

Seok¹,

Park²,

Kim³

2022

J. Micromech. Microeng.

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This paper presents a new simple method to measure thin film material properties using scotch-tape surface wrinkling. Metal thin films have been deposited on polymer substrates by e-beam evaporation. After patterned by photolithography and wet etching, long and narrow thin metal layers have been transferred by peel-off onto the scotch tape. The effect of velocity of scotch tape peel-off on the metal thin film transfer from polymer substrates to the scotch tape has been investigated. After transfer, metal thin film wrinkling patterns have been established on the scotch tape due to mechanical properties mismatch between the two materials. The wrinkling patterns have been characterized in term of amplitude and wavelength and they are compared with FEM (Finite Element Method) buckling simulation results for material properties extraction. By consequence, elastic moduli of 300 nm-thick gold film and a multilayer of 30 nm Ti on 300 nm Au have been found 147 GPa and 885 GPa based on the measured wavelength of the wrinkling films.

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Scotch-Tape Surface Wrinkling Based Thin-Film Material Properties Extraction

Seok¹,

Park²,

Kim³

2022

J. Micromech. Microeng.

0

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This paper presents a new simple method to measure thin film material properties using scotch-tape surface wrinkling. Metal thin films have been deposited on polymer substrates by e-beam evaporation. After patterned by photolithography and wet etching, long and narrow thin metal layers have been transferred by peel-off onto the scotch tape. The effect of velocity of scotch tape peel-off on the metal thin film transfer from polymer substrates to the scotch tape has been investigated. After transfer, metal thin film wrinkling patterns have been established on the scotch tape due to mechanical properties mismatch between the two materials. The wrinkling patterns have been characterized in term of amplitude and wavelength and they are compared with FEM (Finite Element Method) buckling simulation results for material properties extraction. By consequence, elastic moduli of 300 nm-thick gold film and a multilayer of 30 nm Ti on 300 nm Au have been found 147 GPa and 885 GPa based on the measured wavelength of the wrinkling films.

show abstract

Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement

Cited by 3 publications

References 9 publications

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Scotch-tape surface wrinkling based thin-film material properties extraction

Scotch-Tape Surface Wrinkling Based Thin-Film Material Properties Extraction

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