Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Seok, Seonho; Park, Hyung Dal; Kim, Jinseok

doi:10.3390/mi11060605

Cited by 12 publications

(9 citation statements)

References 28 publications

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“…Moreover, the sheet resistance ( R s ) of the fabricated electrodes was measured using a 4-point probe system (Jandel, RM3-AT) at a constant current of 100 mA. The Scotch (3M magic tape) tape test method was applied to investigate the adhesion strength of the metallized layers . Besides, the ASTM D3359-02 standard tape test and ASTM D4541 pull-off adhesion test were conducted to quantify the interfacial adhesion strength between the deposited metal film and the polymer substrate.…”

Section: Methodsmentioning

confidence: 99%

“…The Scotch (3M magic tape) tape test method was applied to investigate the adhesion strength of the metallized layers. 45 Besides, the ASTM D3359-02 standard tape test 46 and ASTM D4541 pull-off adhesion test 47 were conducted to quantify the interfacial adhesion strength between the deposited metal film and the polymer substrate. All the characterizations were performed at room temperature by considering n = 3 specimens for each characterization test.…”

Section: ■ Experimental Sectionmentioning

confidence: 99%

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Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Akin,

Nath,

Jun

2023

ACS Appl. Electron. Mater.

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Selective surface metallization of insulating polymers is of particular interest in smart films, energy harvesting, and sensing applications. However, traditional polymer metallization techniques face challenges due to the need for environmentally hazardous pretreatment (e.g., strong acid etching) and costintensive palladium seeding processes, thereby limiting the largescale deployment of metallized polymers. With the advent of rapid prototyping, metallization on additively manufactured polymers drew attention in a variety of technological applications, as it enables the fabrication of low-cost electronic devices. In the current work, we deploy and evaluate a hybrid additive metallization route that can enable the fabrication of functional selective metallization on 3D-printed polymers in a rapid and eco-friendly methodology with improved electrical conductivity. The metallization route sequentially comprises (1) material extrusion 3D printing, (2) cold spray metallization, and (3) electroless deposition. The resulting metal (copper) layers on the polymer surfaces are characterized in terms of the microstructure, surface chemistry, wettability, and electrical conductivity. Notably, selective metallization with promising electrical conductivity (i.e., 6.47 × 10 6 S m −1 for ABS and 5.27 × 10 6 S m −1 for PLA parts) is achieved on both linear and curvilinear polymer surfaces. Moreover, strong adhesion between the metallized layer and the 3Dprinted structures was confirmed by adhesion tests. Detailed evaluation of the proposed hybrid metallization route unlocks great potential to advance the field of conductive surface metallization on 3D-printed polymers.

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Section: Methodsmentioning

confidence: 99%

Section: ■ Experimental Sectionmentioning

confidence: 99%

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Akin,

Nath,

Jun

2023

ACS Appl. Electron. Mater.

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“…[454] However, the major roadblock in implementing Parylene Cbased encapsulation is its poor adhesion with several substrates and metals commonly used in bioelectronics. [249,497] Techniques such as silanization, O 2 plasma treatment, mechanical interlocking, and annealing improve adhe sion and reduce risk of delamination between layers. [149,[498][499][500] LCP are a promising candidate for encapsulation materials because the high degree of crystallinity results confers excellent barrier properties.…”

Section: Flexible Polymers As Barrier Layersmentioning

confidence: 99%

Recent Progress in Materials Chemistry to Advance Flexible Bioelectronics in Medicine

et al. 2022

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Designing bioelectronic devices that seamlessly integrate with the human body is a technological pursuit of great importance. Bioelectronic medical devices that reliably and chronically interface with the body can advance neuroscience, health monitoring, diagnostics, and therapeutics. Recent major efforts focus on investigating strategies to fabricate flexible, stretchable, and soft electronic devices, and advances in materials chemistry have emerged as fundamental to the creation of the next generation of bioelectronics. This review summarizes contemporary advances and forthcoming technical challenges related to three principal components of bioelectronic devices: i) substrates and structural materials, ii) barrier and encapsulation materials, and iii) conductive materials. Through notable illustrations from the literature, integration and device fabrication strategies and associated challenges for each material class are highlighted.

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“…Next, the effects of CF 4 treatment and scotch tape speed have been investigated by measuring force-displacement curves as shown in figure 5(a) [15]. It is found that (a) scotch tape velocity of 10 mm min −1 has made all metal debonded from polymer substrate with and without CF 4 treatment, while 1 mm min −1 has made partial metal debonding.…”

Section: Sample Preparationmentioning

confidence: 99%

Scotch-tape surface wrinkling based thin-film material properties extraction

Seok¹,

Park²,

Kim³

2022

J. Micromech. Microeng.

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This paper presents a new simple method to measure thin film material properties using scotch-tape surface wrinkling. Metal thin films have been deposited on polymer substrates by e-beam evaporation. After patterned by photolithography and wet etching, long and narrow thin metal layers have been transferred by peel-off onto the scotch tape. The effect of velocity of scotch tape peel-off on the metal thin film transfer from polymer substrates to the scotch tape has been investigated. After transfer, metal thin film wrinkling patterns have been established on the scotch tape due to mechanical properties mismatch between the two materials. The wrinkling patterns have been characterized in term of amplitude and wavelength and they are compared with FEM (Finite Element Method) buckling simulation results for material properties extraction. By consequence, elastic moduli of 300 nm-thick gold film and a multilayer of 30 nm Ti on 300 nm Au have been found 147 GPa and 885 GPa based on the measured wavelength of the wrinkling films.

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Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Cited by 12 publications

References 28 publications

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Recent Progress in Materials Chemistry to Advance Flexible Bioelectronics in Medicine

Scotch-tape surface wrinkling based thin-film material properties extraction

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