Scotch-tape surface wrinkling based thin-film material properties extraction

Seok, Seonho; Park, Hyung Dal; Kim, Jinseok

doi:10.1088/1361-6439/ac542a

Cited by 4 publications

(4 citation statements)

References 20 publications

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“…Temperature and pressure profiles applied for the bonding are found in Ref. [ 27 ]. (c) During BCB curing at 250 °C for 1 h, the BCB ring is fully cured and, thus, its volume shrinkage becomes substantial.…”

Section: Thin-film Transfer Packaging Processmentioning

confidence: 99%

“… Transfer packaging results (modified from Ref. [ 27 ]). ( a ) Buckled thin film bonded on BCB ring (modified from Ref.…”

Section: Figurementioning

confidence: 99%

“…( a ) Buckled thin film bonded on BCB ring (modified from Ref. [ 27 ]). (Transferred film thickness = 0.97 μm, BCB ring width = 150 μm, cavity size of small package = 400 μm × 400 μm); ( b ) Thin-film shape change as a function of time after debonding of carrier Si substrate.…”

Section: Figurementioning

confidence: 99%

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FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Seok

2023

Micromachines

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This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thin-film package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. Based on the simulation results, it is found that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. The mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along a polymeric sealing ring is found.

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Section: Thin-film Transfer Packaging Processmentioning

confidence: 99%

“… Transfer packaging results (modified from Ref. [ 27 ]). ( a ) Buckled thin film bonded on BCB ring (modified from Ref.…”

Section: Figurementioning

confidence: 99%

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FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Seok

2023

Micromachines

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“…Commercial Scotch tape having adhesive on a supporting membrane such as PVC, PET, and PE was also reported as a buckling substrate with an elastic thin film [11].…”

Section: Introductionmentioning

confidence: 99%

Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation

Seok,

Park,

Kim

2024

Micromachines

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This paper presents a direct 3D numerical simulation of biaxial surface wrinkling of thin metal film on a compliant substrate. The selected compliant substrate is a commercial Scotch tape on which a gold metal thin film has been transferred by using low adhesion between the thin metal film and polyimide substrate. Compared with the previous fabrication of a cylindrical thin-film wrinkling pattern, an undulated wrinkling pattern has been implemented by increasing the width of the thin metal film in order to create biaxial straining in the thin film. To understand the wrinkling behavior due to biaxial loading, a simple direct numerical simulation based on material imperfections defined in the compliant substrate has been conducted. Through modeling and simulation, it was found that the wrinkling mode is determined by the biaxiality ratio (BR), the ratio between transversal strain and longitudinal strain. Depending on the BR, the wrinkling mode belongs to one of the cylindrical, undulated (or herringbone), checkerboard, or labyrinth modes as a function of applied strain. The cylindrical wrinkling is dominant at the input of BR less than 0.5, while the undulated (or herringbone) ones become dominant just after the onset of the wrinkling pattern at BR greater than 0.9. Through the comparison of the wrinkling patterns between simulation and experiment, the applied BR of the fabricated thin film has been successfully estimated.

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Fabrication and Analysis of Biaxial Surface Wrinkling of Thin Metal Film on Compliant Substrate Based on Low Adhesion-Assisted Transfer Technique and Direct 3D Numerical Simulation

Seok,

Park,

Kim

2024

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Scotch-tape surface wrinkling based thin-film material properties extraction

Cited by 4 publications

References 20 publications

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation

Fabrication and Analysis of Biaxial Surface Wrinkling of Thin Metal Film on Compliant Substrate Based on Low Adhesion-Assisted Transfer Technique and Direct 3D Numerical Simulation

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