Analysis of static charge induced pull-in of an electrostatic MEMS

Kumar, Mithlesh; Mukherjee, Banibrata; Sen, Siddhartha

doi:10.1016/j.cnsns.2021.105690

Cited by 7 publications

(4 citation statements)

References 31 publications

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“…< 1 is a dimensionless positive parameter that considers, through C f , the possible nonuniform distribution of the electric charge on d-microplate (Dastidar et al, 2023;Kumar et al, 2021). In ( 17), the dependence on V of the action control determines the E in the device, which, in turn, generates an electrostatic pressure that moves the deformable plate (Di Bahreman et al, 2019;Das and Bhushan, 2023).…”

Section: The Micro-electron-mechanical-systems Capacitive Control Cir...mentioning

confidence: 99%

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Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Versaci,

Angiulli,

Fattorusso

et al. 2024

COMPEL

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Purpose Based on previous results of the existence, uniqueness, and regularity conditions for a continuous dynamic model for a parallel-plate electrostatic micro-electron-mechanical-systems with the fringing field, the purpose of this paper concerns a Galerkin-FEM procedure for deformable element deflection recovery. The deflection profiles are reconstructed by assigning the dielectric properties of the moving element. Furthermore, the device’s use conditions and the deformable element’s mechanical stresses are presented and discussed. Design/methodology/approach The Galerkin-FEM approach is based on weighted residuals, where the integrals appearing in the solution equation have been solved using the Crank–Nicolson algorithm. Findings Based on the connection between the fringing field and the electrostatic force, the proposed approach reconstructs the deflection of the deformable element, satisfying the conditions of existence, uniqueness and regularity. The influence of the electromechanical properties of the deformable plate on the method has also been considered and evaluated. Research limitations/implications The developed analytical model focused on a rectangular geometry. Practical implications The device studied is suitable for industrial and biomedical applications. Originality/value This paper proposed numerical approach characterized by low CPU time enables the creation of virtual prototypes that can be analyzed with significant cost reduction and increased productivity.

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Section: The Micro-electron-mechanical-systems Capacitive Control Cir...mentioning

confidence: 99%

“…Remark 3 χ = ϵ 0 a 2 ( C f d ) –1 < 1 is a dimensionless positive parameter that considers, through C f , the possible nonuniform distribution of the electric charge on d-microplate ( Dastidar et al ., 2023 ; Kumar et al. , 2021 ).…”

Section: The Dynamic Continuous Modelmentioning

confidence: 99%

Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Versaci,

Angiulli,

Fattorusso

et al. 2024

COMPEL

View full text Add to dashboard Cite

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“…Also some studies modeled microbeams including functionally graded material [29][30][31][32]. Kumar et.al [33] analyzed static charge induced pull-in of an electrostatic MEMS.…”

Section: Introductionmentioning

confidence: 99%

Design of two layer clamped-clamped microsensor based on classical and non-classical theories

Yekta,

Rahi

2023

Preprint

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In this paper, the two-layer micro sensor is modeled as a two-layer clamped-clamped microbeam and it is optimized using the genetic algorithm. Using the results of this research, clamped- clamped microbeams can be designed in such a way that the performance of microsensors whose structure includes these microbeams will be improved. The quality factor, the sensitivity, and the maximum stress are selected as objective functions. The thickness of each layer, the width of the microbeam, and the length of the microbeam are selected as design variables. The optimization is done based on classical and non-classical theory by the genetic algorithm. The results based on both theories are approximately equal. The length of the microbeam is the most important variable and very changes (approximately 190%). The thickness of the silicon layer has the least effect on the results and changes just lower than 2μm (approximately 20%). The results show that when the maximum stress decreases and the sensitivity increases, the quality factor decreases which is undesirable. Maximum sensitivity obtains when the microbeam is very small.

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“…Although ESD protection technologies have been taken into consideration in the circuit designs [ 2 , 3 , 4 ], in the preliminary stages of manufacturing, the fundamental elements are still under risks of ESD failure. For instance, in the organic light-emitting diode (OLED) screen factories, static charge might arise to 5000 volts on glasses, after such manufacturing processes as surface cleaning, physical vapor deposition, and photoetching [ 5 , 6 , 7 ]. The batch production of integrated circuits and surface mount technology (SMT) processes also face similar problems [ 8 ].…”

Section: Introductionmentioning

confidence: 99%

Resolution-Enhancing Structure for the Electric Field Microsensor Chip

Yang

Zhang

et al. 2021

Micromachines

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Electrostatic voltage is a vital parameter in industrial production lines, for reducing electrostatic discharge harms and improving yields. Due to such drawbacks as package shielding and low resolution, previously reported electric field microsensors are still not applicable for industrial static monitoring uses. In this paper, we introduce a newly designed microsensor package structure, which enhances the field strength inside the package cavity remarkably. This magnification effect was studied and optimized by both theoretical calculation and ANSYS simulation. By means of the digital synthesizer and digital coherent demodulation method, the compact signal processing circuit for the packaged microsensor was also developed. The meter prototype was calibrated above a charged metal plate, and the electric field resolution was 5 V/m, while the measuring error was less than 3 V, from −1 kV to 1 kV in a 2 cm distance. The meter was also installed into a production line and showed good consistency with, and better resolution than, a traditional vibratory capacitance sensor.

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Analysis of static charge induced pull-in of an electrostatic MEMS

Cited by 7 publications

References 31 publications

Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Design of two layer clamped-clamped microsensor based on classical and non-classical theories

Resolution-Enhancing Structure for the Electric Field Microsensor Chip

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