Analysis of solder joint fracture under mechanical bending test

Harada, Kazuki; Baba, Shigeo; Wu, Qiang; Matsushima, H.; Matsunaga, Tomonori; Ucgai, Y.; Kimura, Mayuko

doi:10.1109/ectc.2003.1216536

Cited by 20 publications

(14 citation statements)

References 2 publications

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“…Three-point cyclic bending tests have been performed by many researchers [1]- [4]. Furthermore, Merchdo et al [4] and Harada et al [5] have used a four-point bending test for the ease of later data analysis since the stress developed at the inner loading span can be assumed to be uniform. Generally, single-side boards with one unit are used for the bending test, but single-side or double-side boards with numerous units are also used [2]- [4].…”

Section: Introductionmentioning

confidence: 99%

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Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load

Kim

Lee

2008

IEEE Trans. Comp. Packag. Technol.

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Nowadays, interest in the bending reliability of ball grid array packages has increased with the increase in mobile devices. Initially, bending tests were conducted to certify the safety of an electronic package during the manufacturing and shipping processes. But recently, the purpose of the bending test has changed: cyclic bending tests are being used to evaluate the electronic package's endurance against handling damage such as bending, twisting and key pressure. Furthermore, the bending test is being adopted as an alternative to a drop test. In this study, a four-point cyclic bending test was performed under various loading levels to investigate the fatigue behavior of solder joints with chemical compositions of 95.5Sn4.0Ag0.5Cu and 63Sn37Pb. It was found that the lead-free solder has a longer fatigue life than the lead-contained solder when the applied load is low. A finite element analysis (FEA) with plasticity and creep constitutive equations was conducted because there are no suitable sensors to measure stress and strain of solder ball joints directly. From the analysis results, it was found that the inelastic energy dissipation could be used as a good damage parameter. Also, from the inspection of the failure site and the FEA, it was found that the fatigue crack initiated at the exterior solder joints and propagated into the inner solder joints.Index Terms-Ball grid array (BGA), cyclic bending test, finite element methods (FEM), lead-free solder, Sn-Ag-Cu.

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Section: Introductionmentioning

confidence: 99%

“…These mechanical loads include the bending, twisting, key pressing, vibration, and shock impact due to dropping. Various bending tests have been used to quantitatively estimate the reliability of the solder joints [1]- [5]. Three-point cyclic bending tests have been performed by many researchers [1]- [4].…”

Section: Introductionmentioning

confidence: 99%

Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load

Kim

Lee

2008

IEEE Trans. Comp. Packag. Technol.

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“…Numerous studies on packages with leaded solder joints under bending load are available in open literature [eg. 2,3]. These studies cover both experimental and numerical simulation by finite element (FE) method.…”

Section: Introductionmentioning

confidence: 99%

“…Three-point and four-point-bend tests on electronics packages and assemblies with single or multiple electronics components, and either single-sided or doublesided assembly have been performed [eg. [1][2][3][4][5]. Numerous studies on packages with leaded solder joints under bending load are available in open literature [eg.…”

Section: Introductionmentioning

confidence: 99%

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

Shaffiar

Loh

Kamsah

et al. 2010

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-dependent response of the solder is represented by Anand model. Progressive damage in the solder joint is described using continuum damage model. Results show that the critical solder joint is the one located at the corner of the BGA package. In this critical solder joint, both high stress and inelastic strain are localized in a small edge region at the solder/IMC interface at the board side of the assembly. The different inelastic strain rates experienced by the critical solder joint during fatigue cycles correspond to the distinct damage initiation stage, crack propagation stage and the final fast fracture of the solder joint. Damage initiation life covers nearly half of the total fatigue lives of the critical solder.

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“…These stress events can occur during board assembly/test, shipment/handling operations, or actual end-use. Recent investigations have documented voiding at the pad/solder interface for various plating/solder material combinations [1][2][3][4][5]. The interfacial voids appear to relate to observed brittle solder joint fractures.…”

Section: Introductionmentioning

confidence: 99%

BGA brittle fracture - alternative solder joint integrity test methods

Newman

Proceedings Electronic Components and Technology, 2005. ECTC '05.

110

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A solder ball shear and pull testing study was conducted on 27 unique package constructions, evaluated under a wide variety of test conditions. The study encompassed the coordinated efforts of 7 electronics manufacturers using earlyprototype high speed solder ball shear/pull equipment. Shear speeds ranged from a conventional 0.0001 m/s (100 µm/s) rate up to as high as 4 m/s, while pull testing ranged from speeds of 0.0005 m/s (500 µm/s) to 1.3 m/s. The many package configurations varied in substrate plating type (exposed Cu, electrolytic NiAu and electroless-Ni/immersion-Au), solder composition (SnPb, SnPbAg and SnAgCu), packaging construction and materials, solder and package geometries, package assembly location, and time between reflow and test.

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Analysis of solder joint fracture under mechanical bending test

Cited by 20 publications

References 2 publications

Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load

Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

BGA brittle fracture - alternative solder joint integrity test methods

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