BGA brittle fracture - alternative solder joint integrity test methods

Newman, Keith

doi:10.1109/ectc.2005.1441422

Cited by 111 publications

(45 citation statements)

References 12 publications

(19 reference statements)

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“…Many different high-strain-rate methods ranging from the classical split Hopkinson pressure bar [34][35][36][37] and miniature Charpy testers [38][39][40] for single solder balls to sophisticated drop testers for populated component boards have been proposed for studying the impact reliability electrical components and assemblies (see Fig. 2).…”

Section: Methods Of Shock Impact Testingmentioning

confidence: 99%

See 1 more Smart Citation

Board‐Level Reliability of Lead‐Free Solder under Mechanical Shock and Vibration Loads

Matilla¹,

Marjamäki²,

Kivilahti³

2011

Structural Dynamics of Electronic and Photonic Systems

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Section: Methods Of Shock Impact Testingmentioning

confidence: 99%

“…2). The single joint testers are typically component-level tests where individual solder bumps are either sheared [38][39][40][41][42][43][44] or pulled [45][46][47][48][49] from the packages by using striker probes or mechanical jaws and the force required to detach the bump is recorded.…”

Section: Methods Of Shock Impact Testingmentioning

confidence: 99%

Board‐Level Reliability of Lead‐Free Solder under Mechanical Shock and Vibration Loads

Matilla¹,

Marjamäki²,

Kivilahti³

2011

Structural Dynamics of Electronic and Photonic Systems

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“…Table III shows the parameters used for the shear tests. Note that the shear force depends on shear speed (Newman, 2005). Each board was cut into two identical pieces.…”

Section: Experimental Design and Proceduresmentioning

confidence: 99%

The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Pan

Toleno

Chou

et al. 2006

Soldering & Surface Mount Tech

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Purpose -The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength. Design/methodology/approach -Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (2308C, 2408C, and 2508C for Sn3.0Ag0.5Cu; and 1958C, 2058C, and 2158C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear forces for the resistors were measured after assembly. The fracture interfaces were inspected using scanning electron microscopy with energy dispersive spectroscopy in order to determine the failure mode and failure surface morphology. Findings -The results show that the effects of the peak temperature and the time above solder liquidus temperature are not consistent between different component sizes and between Sn37Pb and Sn3.0Ag0.5Cu solder. The shear force of SnPb solder joints is higher than that of Sn3.0Ag0.5Cu solder joints because the wetting of SnPb is better than that of SnAgCu. Research limitations/implications -This study finds that fracture occurred partially in the termination metallization and partially in the bulk solder joint. To eliminate the effect of the termination metallization, future research is recommended to conduct the same study on solder joints without component attachment. Practical implications -The shear strength of both SnPb and SnAgCu solder joints is equal to or higher than that of the termination metallization for the components tested. Originality/value -Fracture was observed to occur partially in the termination metallization (Ag layer) and partially in the bulk solder joint. Therefore, it is essential to inspect the fracture interfaces when comparing solder joint shear strength.

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“…[11] The speed of impact testing ranged from 10 mm/s to 4,000 mm/s. Both the shear load and the fracture energy of solder joint were plotted.…”

Section: Impact Shear Testingmentioning

confidence: 99%

Mechanical Shock Durability Studies of Sn-Ag-Cu-Ni BGA Solder Joints on Electroless Ni-P/Au Surface Finish

Kawashiro

Yanase

Ujiie

et al. 2009

Transactions of The Japan Institute of Electronics Packaging

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In this study, 60 solder compositions were examined in an effort to improve the integrity against impact loads of the solder joints on an electroless Ni-P/Au surface finish. The Ag, Cu, and Ni contents in the Sn-based solder varied from 0 to 4.5 wt%, 0 to 2.0 wt%, and 0 to 0.05 wt%, respectively. Impact shear tests were performed to investigate solder joint integrity after solder ball reflowing, after reflow soldering twice more, after storage at room temperature for 168 hours, and after storage at 150°C for 1,000 hours. According to the results, the Ag content should be as low as possible, the Cu content should be from 0.5 to 0.7 wt%, and the Ni content should be as high as possible. The Ag and Ni contents should be determined in consideration of the wettability and the board-level reliability of the solder joints.

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BGA brittle fracture - alternative solder joint integrity test methods

Cited by 111 publications

References 12 publications

Board‐Level Reliability of Lead‐Free Solder under Mechanical Shock and Vibration Loads

Board‐Level Reliability of Lead‐Free Solder under Mechanical Shock and Vibration Loads

The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Mechanical Shock Durability Studies of Sn-Ag-Cu-Ni BGA Solder Joints on Electroless Ni-P/Au Surface Finish

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