Polycrystalline silicon thin films prepared by the pyrolysis of silane with the assistance of a plasma have been investigated. The films were deposited in an experimental CVD reactor at a deposition pressure of 6 mtorr, and over the temperature range of 500 ~ to 800~ The foremost characteristic of the plasma was the enhancement of the growth rate of the film. A thirtyfold increase in growth rate was observed in films deposited at 600~ by plasma enhancement over similar films deposited thermally. The films deposited below 600~ were amorphous. The glow-discharge was also seen to favor the nucleation of <220> islands in the polysilicon film, but had no effect on the electrical properties of the film. In situ doped n-type polysilicon films were deposited by plasma enhancement from AsHjSiH4 mixtures. The growth rate of the latter films was found to be weakly sensitive to the arsine dilution in silane. For p-type depositions from B2H6/SiH4 mixtures, the plasma promoted the decomposition of the reactant gas, resulting in a growth rate enhancement. The texture of the doped polysilicon films deposited with plasma enhancement was insensitive to dopant dilution in the reactant gas. Moreover, the conductivities of the n-and p-type doped films were successfully modulated by over six orders of magnitude when the dopant dilution in the reactant gas was increased from 0 to 500 ppm. Finally, a segregation of the dopant atoms from the gas phase to the solid phase was observed for both p-and n-type dopants.