Analysis of Poly(tetrafluoroethylene) (PTFE) by XPS

Girardeaux, Christophe; Pireaux, Jean‐Jacques

doi:10.1116/1.1247814

Cited by 35 publications

(32 citation statements)

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“…The quantitative analyses of the surface chemical compositions, obtained by using established sensitivity factors, are found in Table 4. As expected, sample 1, pure PTFE, contains only C and F. Both the C1s peak shape and the C:F ratio are essentially identical to those of standard bulk PTFE [38].…”

Section: Surface Morphologies Of the Ptfe Filmssupporting

confidence: 57%

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Durable superhydrophobic PTFE films through the introduction of micro- and nanostructured pores

Zhang¹,

Ge²,

Yang³

et al. 2015

Applied Surface Science

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Section: Surface Morphologies Of the Ptfe Filmssupporting

confidence: 57%

“…Since the samples are insulators, we used an additional low energy (<50 eV) electron gun for surface neutralization during the measurements. We aligned the energy scale following reference [38], where the main C1s peak ( CF 2 ) was placed at 292.53 eV.…”

Section: X-ray Photoelectron Spectroscopy (Xps)mentioning

confidence: 99%

Durable superhydrophobic PTFE films through the introduction of micro- and nanostructured pores

Zhang¹,

Ge²,

Yang³

et al. 2015

Applied Surface Science

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“…Based on the XPS analysis of the C 4 F 8 plasma-treated surfaces, it could be inferred that the anti-adhesion surface properties are due to the formation of a thin (from ~ 0.5 nm to a few nm) layer of a fluorocarbon compound, with a chemical content very close to that of PTFE [25]. Two possible mechanisms are proposed for the formation of this fluorinated layer.…”

Section: Discussionmentioning

confidence: 99%

Plasma fluorination of diamond-like carbon surfaces: mechanism and application to nanoimprint lithography

Schvartzman

Wind

2009

Nanotechnology

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Diamond-like carbon (DLC) films, used as molds for nanoimprint lithography, were treated with a fluorocarbon-based plasma in order to enhance their anti-adhesion properties. While elllipsometry and AFM measurements showed negligible changes in thickness and surface roughness after plasma processing, contact angle measurement found fluorine plasma-treated DLC surfaces to be highly hydrophobic, with surface energy values reduced from ~ 45 mJ/m 2 for untreated films to ~ 20-30 mJ/m2 after fluorination. XPS revealed a thin (from ~ 0.5 nm to ~ 3 nm) fluorocarbon layer on the DLC surface. Proposed mechanisms for the formation of this layer include two competing processes: etching of DLC and deposition of fluorocarbon material, with one or the other mechanism dominant depending on the plasma conditions. Fluorocarbon plasma-treated DLC molds for nanoimprint lithography were used to pattern sub-20 nm size features with a high degree of repeatability, demonstrating an extended lifetime of the anti-adhesion coating.

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“…Both PVD methods produced a very different surface chemical composition of the prepared coatings. The C 1 s envelope of the e-beam method resembles a PTFE-like film [61], but with a value of the high-energy peak moved to even higher energies than a typical -CF 2 -signal in pure PTFE (292.53 eV). Therefore, the C 1 s signal position of 294.0 eV (Fig.…”

Section: Refractive Index Measurementmentioning

confidence: 98%

Adjustable, (super)hydrophobicity by e-beam deposition of nanostructured PTFE on textured silicon surfaces

et al. 2015

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Polytetrafluoroethylene (PTFE)-like films, produced by electron beam (e-beam) deposition, have shown higher hydrophobicity than those deposited by RF sputtering under similar deposition rates. It was found that this results from both surface chemical composition and nano-roughness. X-ray photoelectron spectroscopy measurements revealed that larger moieties of CF 2 and CF 3 groups were present to reduce surface energy in the e-beam deposited films. RF sputtering led to a higher degree of PTFE target fragmentation producing a different perfluorinated film on the Si substrate. Scanning electron microscopy and atomic force microscopy measurements revealed a much larger rms roughness on the film surfaces produced by e-beam (25.13 nm, at 20 mA) than those by RF sputtering (2.42 nm, at 100 W), and allowed a broad power spectrum density analysis with determination of the j B wetting parameter. In addition, the e-beam deposited films presented a linear increase of contact angle with applied electron current in the range under study (5-20 mA). This allows easy water repellency adjustment, up to 159 ± 2°. For a superhydrophobic state with self-cleaning, a micropyramid structure was wet etched on the Si wafer, followed by PTFE deposition, and a very low contact angle (163 ± 2°) and hysteresis was attained (\3°). These first results indicate that e-beam PTFE deposition with adjustable hydrophobicity may become a useful technique for integrated production with present Si microelectronics technology and for Si solar cells.

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Analysis of Poly(tetrafluoroethylene) (PTFE) by XPS

Abstract: Reactivity of Cu with poly(tetrafluoroethylene) and poly(vinyl chloride): Effect of pre-and post-metallization modification on the metal/polymer interface J.

Cited by 35 publications

References 1 publication

Durable superhydrophobic PTFE films through the introduction of micro- and nanostructured pores

Durable superhydrophobic PTFE films through the introduction of micro- and nanostructured pores

Plasma fluorination of diamond-like carbon surfaces: mechanism and application to nanoimprint lithography

Adjustable, (super)hydrophobicity by e-beam deposition of nanostructured PTFE on textured silicon surfaces

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