Analysis of coupled simultaneous switching noise induced from power delivery network in adjacent switching circuit

Kim, Jongmin; Song, Ki-Jae; Yoo, Jongwoon; Nah, Wansoo

doi:10.1109/eptc.2009.5416402

Cited by 2 publications

(1 citation statement)

References 7 publications

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“…이러한 이유로, 고속 모바일 시스템의 최적화를 위해서는 스위칭 노이즈(SSN)를 최소화하 기 위한 대책이 필요하고, 이를 수행하기 위해서는 전원분배망(PDN)의 임피던스 특성에 대하여 정확 하게 예측할 수 있는 모델이 필요하다. 전원분배망 (PDN)의 임피던스를 예측하는 3가지 방법으로 전송 선로를 이용한 TLM(Transmission Line Method) [1], [4], [5] 방법과 cavity 모드 공진을 이용하여 임피던스를 계 산 [6], [7] 하는 방법, 그리고 full-wave 시뮬레이션 툴 [1], [5], [7], [11] 을 이용하여 임피던스를 예측하고 있다. 기존 분배망(PDN) 특성을 고려해야 한다 [8] .…”

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Novel Extraction Method for Unknown Chip PDN Using De-Embedding Technique

Kim¹,

Lee²,

Kim³

et al. 2013

The Journal of Korean Institute of Electromagnetic Engineering

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GDS format files, as well as layout of the chip are noticeably needed so as to analyze the PDN (Power Delivery Network) inside of IC; however, commercial IC in the market has not supported design information which is layout of IC. Within this, in terms of IC having on-chip PDN, characteristic of inside PDN of the chip is a core parameter to predict generated noise from power/ground planes. Consequently, there is a need to scrutinize extraction method for unknown PDN of the chip in this paper. To extract PDN of the chip without IC circuit information, the de-embedding test vehicle is fabricated based on IEC62014-3. Further more, the extracted inside PDN of chip from de-embedding technique adopts the Co-simulation model which composes PCB, QFN (Quad-FlatNo-leads) Package, and Chip for the PDN, applied Co-simulation model well corresponds with impedance from measured S-parameters up to 4 GHz at common measured and simulated points.

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