2011
DOI: 10.1007/s11771-011-0757-8
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Analysis and simulation of lateral PIN photodiode gated by transparent electrode fabricated on fully-depleted SOI film

Abstract: A novel device, lateral PIN photodiode gated by transparent electrode (LPIN PD-GTE) fabricated on fully-depleted SOI film was proposed. ITO film was adopted in the device as gate electrode to reduce the light absorption. Thin Si film was fully depleted under gate voltage to achieve low dark current and high photo-to-dark current ratio. The model of gate voltage was obtained and the numerical simulations were presented by ATLAS. Current−voltage characteristics of LPIN PD-GTE obtained in dark (dark current) and … Show more

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Cited by 7 publications
(4 citation statements)
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“…As W ch increased, therefore, the dark current was enlarged by increasing the thermally excited carriers. This phenomenon was observed in the previous study of the channel length effect on dark current [ 29 ]. However, the photocurrent also increases with the increase of W ch because the increased active area generates more electron-hole pairs.…”
Section: Resultssupporting
confidence: 78%
“…As W ch increased, therefore, the dark current was enlarged by increasing the thermally excited carriers. This phenomenon was observed in the previous study of the channel length effect on dark current [ 29 ]. However, the photocurrent also increases with the increase of W ch because the increased active area generates more electron-hole pairs.…”
Section: Resultssupporting
confidence: 78%
“…[8][9][10]. Based on standard SOI technology and CMOS process, the photodetector structure resembles LPIN photodiode, but only with ITO deposited on the topside as transparent gate electrode.…”
Section: Introductionmentioning
confidence: 99%
“…Assuming no recombination in the depletion region, photogenerated electron‐hole pairs are separated by the built‐in field. Because of the resistance of the p–n junction, all of majority carriers cannot across depletion region . Therefore, only photogenerated carriers in region I to III diffuse to the side of the junction.…”
Section: The Detailed Physical Modelmentioning
confidence: 99%
“…In recent years, photoelectric products have attracted increasing interest for both civilian and military applications . With the scaling down of complementary metal‐oxide semiconductor (CMOS) technology from sub‐micron process to deep sub‐micron process, developing high sensitivity, high integration, low power, low cost, and miniaturization of optical detection system has been possible . Because of ultraviolet absorption depth in silicon is less than 200 nm, the responsivity and selectivity of photodiode for ultraviolet (UV), which manufactured in a general CMOS process are poorly .…”
Section: Introductionmentioning
confidence: 99%