Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect

Miura, Noriyuki; Mizoguchi, D.; Sakurai, Takayasu; Kuroda, Tadahiro

doi:10.1109/jssc.2005.845560

Cited by 117 publications

(102 citation statements)

References 10 publications

Supporting

Mentioning

100

Contrasting

Order By: Relevance

“…They suggest frequency division multiple access similar to our DWDM to provide multiple channels per waveguide. Capacitive [10] and inductive [23] coupling technologies can provide wireless chip-to-chip communication which can be used within a package.…”

Section: Related Workmentioning

confidence: 99%

Corona: System Implications of Emerging Nanophotonic Technology

Vantrease

Schreiber

Monchiero

et al. 2008

2008 International Symposium on Computer Architecture

428

479

View full text Add to dashboard Cite

We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance, memory and inter-core bandwidths will also have to scale by orders of magnitude. Pin limitations, the energy cost of electrical signaling, and the non-scalability of chip-length global wires are significant bandwidth impediments. Recent developments in silicon nanophotonic technology have the potential to meet these off-and on-stack bandwidth requirements at acceptable power levels.Corona is a 3D many-core architecture that uses nanophotonic communication for both inter-core communication and off-stack communication to memory or I/O devices. Its peak floating-point performance is 10 teraflops. Dense wavelength division multiplexed optically connected memory modules provide 10 terabyte per second memory bandwidth. A photonic crossbar fully interconnects its 256 low-power multithreaded cores at 20 terabyte per second bandwidth. We have simulated a 1024 thread Corona system running synthetic benchmarks and scaled versions of the SPLASH-2 benchmark suite. We believe that in comparison with an electrically-connected many-core alternative that uses the same on-stack interconnect power, Corona can provide 2 to 6 times more performance on many memoryintensive workloads, while simultaneously reducing power.

show abstract

Section: Related Workmentioning

confidence: 99%

Corona: System Implications of Emerging Nanophotonic Technology

Vantrease

Schreiber

Monchiero

et al. 2008

2008 International Symposium on Computer Architecture

428

479

View full text Add to dashboard Cite

show abstract

“…However, there is a high risk of false data detection when the noise level exceeds the sensitivity of the receiver. Consequently, the NRZ system has a larger bit error rate (BER) in noisy environments [3,4]. BPM signaling can be used to overcome some of the problems related to inductive links with NRZ signaling.…”

Section: Inductive-coupling System With Bpm Signaling 1 Conventimentioning

confidence: 99%

An Inductive-coupling Link with a Complementary Switching Transmitter and an Integrating Receiver

Jeong¹,

Kim²,

Kim³

et al. 2014

JSTS:Journal of Semiconductor Technology and Science

View full text Add to dashboard Cite

Abstract-A transceiver for a high-speed inductivecoupling link is proposed. The bi-phase modulation (BPM) signaling scheme is used due to its good noise immunity. The transmitter utilizes a complementary switching method to remove glitches in transmitted data. To increase the timing margin on the receiver side, an integrating receiver with a pre-charging equalizer is employed. The proposed transceiver was implemented via a 130-nm CMOS process. The measured timing window for a 10 -12 bit error rate (BER) at 1.8 Gb/s was 0.33 UI.

show abstract

“…Although misalignments between the horizontal locations of the inductors in adjacent planes can affect the coupling coefficient, the effect is weaker as compared to TSVs where misalignments can result in defective and/or failed links. [32][33][34] This situation means that greater alignment margins can be supported by the inductive link, which facilitates manufacturing. Alternatively, design implications are raised for these links since larger interference or weaker coupling among the inductor is possible.…”

Section: Design Challenges For Inductive Linksmentioning

confidence: 99%

“…Several equivalent circuits for spiral inductors have been proposed. [34][35][36] The equivalent circuit considered in this paper is depicted in Figure 2(b). The scattering parameter of this model can be described by…”

Section: Thermal-aware Signal Integrity Analysis For Inductive Links mentioning

confidence: 99%

“…The contactless 3-D ICs are formed by bonding, typically, bare dice with a diversity of methods. 2 In these circuits, communication among circuits in different planes is achieved through AC-coupling which uses the transitions of a digital signal as the useful part of information and discards the DC component. Specialized links transfer data among the planes either capacitively 3 or inductively.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Inter-Plane Communication Methods for 3-D ICs

Rahimian¹,

Pavlidis²,

Micheli³

2012

Journal of Low Power Electronics

View full text Add to dashboard Cite

Three-dimensional (3-D) integration is an emerging candidate for implementing high performance multifunctional systems-on-chip. Employing an efficient medium for data communication among different planes is a key factor in achieving a high performance 3-D system. Through Silicon Vias (TSVs) provide high bandwidth, high density inter-plane links while facilitating the flow of heat in 3-D circuits. This paper provides an overview of the diverse applications of TSVs within 3-D circuits and surveys the manufacturing and design challenges relating to these interconnects. Inter-plane communication through AC-coupled on-chip inductors is also discussed as an alternative to TSVs. Although there have been several efforts that model the electrical characteristics of these inter-plane communication schemes, the effect that heat can have on the performance of the inter-plane link implemented with either means has not sufficiently been investigated. Consequently, some insight on the effects of thermal gradients on the performance of these links is offered. Results indicate that the electrical performance of TSV is not susceptible to temperature variations. Signal integrity can, however, be degraded in the case of pronounced thermal gradients in contactless 3-D ICs, as demonstrated by a decay of the S-parameters for the investigated inductive links.

show abstract

Analysis and design of inductive coupling and transceiver circuit for inductive inter-chip wireless superconnect

Cited by 117 publications

References 10 publications

Corona: System Implications of Emerging Nanophotonic Technology

Corona: System Implications of Emerging Nanophotonic Technology

An Inductive-coupling Link with a Complementary Switching Transmitter and an Integrating Receiver

Inter-Plane Communication Methods for 3-D ICs

Contact Info

Product

Resources

About