ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference 2016
DOI: 10.1109/esscirc.2016.7598339
|View full text |Cite
|
Sign up to set email alerts
|

An integrated inductive VR with a 250MHz all-digital multisampled compensator and on-chip auto-tuning of coefficients in 130nm CMOS

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
4
0

Year Published

2016
2016
2021
2021

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 5 publications
(4 citation statements)
references
References 7 publications
0
4
0
Order By: Relevance
“…However, it is specific for AES engines that use a fixed key. Noise injection and power isolation are other techniques that hide the intermediate values of encryption operations [17,22,25,26,48,49]. The authors of ANSI [17] combine these two techniques to implement a generic solution for encryption algorithms with negligible performance overhead.…”
Section: Power Analysis Attack Countermeasuresmentioning
confidence: 99%
“…However, it is specific for AES engines that use a fixed key. Noise injection and power isolation are other techniques that hide the intermediate values of encryption operations [17,22,25,26,48,49]. The authors of ANSI [17] combine these two techniques to implement a generic solution for encryption algorithms with negligible performance overhead.…”
Section: Power Analysis Attack Countermeasuresmentioning
confidence: 99%
“…in [54] used air-core package inductance for realizing a high frequency power stage. Package bondwires offer relatively higher inductance value than on-chip inductance and have been used in inductive IVRs [49,52,53,43,61]. Recently published works report magnetic interposer [59], magnetic thin film [60], on-chip solenoid [55] and embedded magnetic core inductors [62] achieving higher inductance density than the traditional on-chip spiral or package inductors.…”
Section: Integration Of On-chip/on-package Inductancementioning
confidence: 99%
“…IVRs demonstrate fast recovery from voltage droops due to load current transients as well as fast switching from one reference voltage (corresponding to a power-state of the processor) to another reference voltage [41,1,42,35,43,44]. VRs, specifically switching VRs like inductive buck regulators [55,50] and SCVRs [42,36] require passives (inductors and capacitors) which typically are implemented as discrete PCB components for VRMs with low switching frequencies.…”
Section: Chapter 3 Modeling and Analysismentioning
confidence: 99%
See 1 more Smart Citation