An Indentation Technique for Measuring Stresses in Tempered Glass Surfaces

Marshall, D. B.; Lawn, B. R.

doi:10.1111/j.1151-2916.1977.tb16106.x

Cited by 237 publications

(104 citation statements)

References 4 publications

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“…If there are surface compression stresses, then the indentation crack lengths at a particular indentation load will be shorter than those in for an annealed piece of material. 111,112 Assuming that the indentation crack slows down and stops at KI = KIc, and that slow crack growth doesn't affect its length, then:…”

Section: Estimates Of Residual Stresses From Indentation Crack Sizesmentioning

confidence: 99%

NIST Recommended Practice Guide Fractography of Ceramics and Glasses

Quinn¹

2016

108

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Section: Estimates Of Residual Stresses From Indentation Crack Sizesmentioning

confidence: 99%

NIST Recommended Practice Guide Fractography of Ceramics and Glasses

Quinn¹

2016

108

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“…4a, where c represents the crack length and a represents the impression size. The condition for a well developed crack is cited [32,33] as c/a [ 2. Based on the fracture mechanics analysis, the fracture toughness, K IC , and the crack length, c, are related as [34] …”

Section: Fracture Toughnessmentioning

confidence: 99%

Mechanical properties of porous methyl silsesquioxane and nanoclustering silica films using atomic force microscope

Gaire

Arao³

et al. 2008

J Porous Mater

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Mechanical properties of porous methyl silsesquioxane samples with dielectric constant 2.4 and 2.0 and a recently developed nanoclustering silica film samples with dielectric constants 2.3 and 2.0 were evaluated using an atomic force microscope based nanoindentation. It was found that the Young's modulus and the hardness decrease while the fracture toughness increases with a decrease in the dielectric constant in the same type of material. Moreover, the Young's modulus and the hardness of the nanoclustering silica films were observed to be at least twice and fracture toughness values *1.3-1.5 higher than those for methyl silsesquioxane films with similar dielectric constants. The high resolution topographic imaging capability of atomic force microscope was shown to be particularly useful in the measurement of cracks generated by the ultra-low indentation loads, and the evaluation of the fracture toughness of the nanoscale volumes of materials.

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“…A half penny-shaped fracture pattern will develop along the indentation diagonals with the radial crack diameter 2C. The relationship between the indentation load P and the corresponding crack length C is given by [7] (3) where k represents a dimensionless modification factor whose value is close to unity, and K,, the fracture toughness. The (P/ C3") pro term represents the load and crack length measured in a stress-free state.…”

Section: Indentation Techniquesmentioning

confidence: 99%