Mechanical properties of porous methyl silsesquioxane samples with dielectric constant 2.4 and 2.0 and a recently developed nanoclustering silica film samples with dielectric constants 2.3 and 2.0 were evaluated using an atomic force microscope based nanoindentation. It was found that the Young's modulus and the hardness decrease while the fracture toughness increases with a decrease in the dielectric constant in the same type of material. Moreover, the Young's modulus and the hardness of the nanoclustering silica films were observed to be at least twice and fracture toughness values *1.3-1.5 higher than those for methyl silsesquioxane films with similar dielectric constants. The high resolution topographic imaging capability of atomic force microscope was shown to be particularly useful in the measurement of cracks generated by the ultra-low indentation loads, and the evaluation of the fracture toughness of the nanoscale volumes of materials.
In highly dissociated hydrogen plasmas the imprisonment of resonance radiation can significantly increase the effective ljfetime of then =Z state to such an extent that gas phase collision involving H(n = 2) become important. Under these conditions the excitation of the H2('ZU) repulsive state which leads to H atom production O C C U~ with a higher probability through excitation transfer collisions between H (n = 2) and ground state H, than through direct electron impact collisions with ground state H,.
We applied ellipsometric porosimetry and variable-energy positron annihilation spectroscopy to the pore characterization of spin-on-glass silicon-oxide-backboned porous thin films with different relative dielectric constants between 2.3 and 3.2. It was found that the relative dielectric constant decreases linearly with increasing open porosity deduced by ellipsometric porosimetry.Comparison of the open porosity with the average pore size deduced by positron annihilation lifetime spectroscopy suggested that mesopores less contribute to open porosity and are not so effective in decreasing film relative dielectric constant in comparison with micropores.
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