1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers
DOI: 10.1109/isscc.1997.585262
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An embedded DRAM module using a dual sense amplifier architecture in a logic process

Abstract: A dual sense amplifier array architecture (DSSA) amenable to a logic-process-compatible 1T DRAM eliminates the penalty that can be imposed by any two-bank-architecture-based DRAM. The concept is illustrated in Figure 1. Two sense amplifier arrays, SA1 and SA2, are available for one memory array. A bank boundary, a data accessablehnaccessable border of the sense amplifier array, does not exist in the DSAA configuration. Any location o f the memory array can be accessed by both SA1 and SA2. While one sense ampli… Show more

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Cited by 7 publications
(4 citation statements)
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“…For example, an RLDRAM die is reported to be 40-80% larger than a comparable DDR2 DRAM die [20]. Alternatively, the ideas of embedding DRAM into processor dies [7], embedding SRAM into DRAM dies [56], or providing multiple row buffers per DRAM bank [14,29] have been proposed, but they are more suitable for caches. Stacking DRAM dies on top of the processor die [46] can reduce main-memory access latency and power, as the physical distances and impedance between the dies are greatly reduced.…”
Section: Introductionmentioning
confidence: 99%
“…For example, an RLDRAM die is reported to be 40-80% larger than a comparable DDR2 DRAM die [20]. Alternatively, the ideas of embedding DRAM into processor dies [7], embedding SRAM into DRAM dies [56], or providing multiple row buffers per DRAM bank [14,29] have been proposed, but they are more suitable for caches. Stacking DRAM dies on top of the processor die [46] can reduce main-memory access latency and power, as the physical distances and impedance between the dies are greatly reduced.…”
Section: Introductionmentioning
confidence: 99%
“…In this way, it becomes possible to reduce the size of local memory by 1 / m Z, where Z is the number of accesses to the memory required in a one-time write-down of multioperand multiplication-addition. In the proposed PE, m and Z can be m = 4, Z = 1 and two quasi-2-port memory DRAMs are provided using 2 sense-amplifiers [16]. By one-time memory access for the write-down and three-time memory access for the readout of one multioperand multiplication-addition, 2 writes/11 (12) reads can equivalently be realized in the multiport local memory.…”
Section: Structure Of Reconfigurable Vlsi Processor Based On Bit-serimentioning
confidence: 99%
“…As 90nm is becoming the mainstream IC fabrication technology, DRAM processing technology and logic processing technology diverge more and more even both are CMOS technologies. Although embedded DRAM (eDRAM) is a high performance solution for DRAM/Logic integration and is chosen by high performance system whose bandwidth can be up to 40 GB/s (GigaByte/seconds), its low yield and high fabrication complexity prevent it from being widely adapted in the IC designs [2,3,4]. The growing memory size needed for the system makes it even more difficult for eDRAM to become a practical DRAM/logic integration solution.…”
Section: Introductionmentioning
confidence: 99%