2017
DOI: 10.1109/led.2017.2747898
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An E-Mode p-Channel GaN MOSHFET for a CMOS Compatible PMIC

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Cited by 6 publications
(5 citation statements)
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References 21 publications
(26 reference statements)
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“…6 b , under the gates of the Pch MOSFETs, the undoped GaN layer remains on the AlGaN layer. In such device geometry, theoretical analysis and calculations indicated that positive V T values are expected due to the high‐density negative polarisation charge at the upper GaN/AlGaN heterointerface [31, 32]. Therefore, our measured results implied that additional positive charges or donor type traps existed in the fabricated Pch MOS structures and these defects could deplete the 2DHG under the gates.…”
Section: Resultsmentioning
confidence: 89%
“…6 b , under the gates of the Pch MOSFETs, the undoped GaN layer remains on the AlGaN layer. In such device geometry, theoretical analysis and calculations indicated that positive V T values are expected due to the high‐density negative polarisation charge at the upper GaN/AlGaN heterointerface [31, 32]. Therefore, our measured results implied that additional positive charges or donor type traps existed in the fabricated Pch MOS structures and these defects could deplete the 2DHG under the gates.…”
Section: Resultsmentioning
confidence: 89%
“…The most common approach for achieving 2DHG is represented by inverting the common AlGaN/GaN sequence. [3][4][5] However, in this case an additional 2DEG is created at the back-side of a doubleheterostructure GaN/AlGaN/GaN QW exhibiting a possible shunt and a parasitic capacitance. Here we suggest a noninverted InAl(Ga)N/GaN system where a sole 2DHG is provided by an In-rich InAl(Ga)N barrier.…”
mentioning
confidence: 99%
“…The key models employed in the simulation include Shockley-Read-Hall model, Fermi-Dirac model, polarization models (POLARIZATION and CALC. STRAIN for spontaneous polarization and piezoelectric polarization, respectively), Auger recombination (AUGER), and constant low-field mobility model [32,33]. In order to well match the actual device characteristics, based on previous reports, the simulation parameters are set as follows: the gate metal work function of 4.8 eV [19]; the Al 2 O 3 relative dielectric constant of 9.3; the specific Ohmic contact resistance (ρ C ) of 1.4 × 10 −4 Ω•cm 2 for all devices, same as the value reported in [34].…”
Section: Physical Models Used In Tcad Simulationmentioning
confidence: 99%