2021
DOI: 10.1002/adma.202102684
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An Anti‐Fatigue Design Strategy for 3D Ribbon‐Shaped Flexible Electronics

Abstract: Three‐dimensional (3D) flexible electronics represent an emerging area of intensive attention in recent years, owing to their broad‐ranging applications in wearable electronics, flexible robots, tissue/cell scaffolds, among others. The widely adopted 3D conductive mesostructures in the functional device systems would inevitably undergo repetitive out‐of‐plane compressions during practical operations, and thus, anti‐fatigue design strategies are of great significance to improve the reliability of 3D flexible el… Show more

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Cited by 30 publications
(18 citation statements)
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“…It has been revealed in Figure that the present design involves the Cu/PI organic–inorganic composite structure, which, according to the literature, helps increase the ductility of Cu by delocalizing its deformation. To validate the protective effect of PI against rupture of Cu, we conducted a uniaxial tensile test for a straight Cu/PI/Cu composite structure with thicknesses of 18 μm, 100 μm, and 18 μm; a length of 40 mm; and a width of 0.3 mm.…”
Section: Results and Discussionmentioning
confidence: 62%
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“…It has been revealed in Figure that the present design involves the Cu/PI organic–inorganic composite structure, which, according to the literature, helps increase the ductility of Cu by delocalizing its deformation. To validate the protective effect of PI against rupture of Cu, we conducted a uniaxial tensile test for a straight Cu/PI/Cu composite structure with thicknesses of 18 μm, 100 μm, and 18 μm; a length of 40 mm; and a width of 0.3 mm.…”
Section: Results and Discussionmentioning
confidence: 62%
“…Here, the design of a thick Cu layer is of great significance to reduce the thermal loss and ensure the electrical performance of the SEFM . The thick PI layer is beneficial to increasing the ductility of Cu by delocalizing its deformation, enhancing the restoring ability and antifatigue ability . Through-hole punching and Cu deposition were used at certain locations of the etched film to connect electrodes of the two sides.…”
Section: Results and Discussionmentioning
confidence: 99%
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“…The buffer layer strategy can also be extended to the islandbridge systems consisting of 3D helical interconnects formed by the mechanically guided assembly techniques (see Figure 6a), as reported in recent years. [69][70][71][72][73][74][75][76][77][78][79][80][81] 3D helical interconnects have shown superior performances in compliance as well as stretchability. [18,61,82] However, in some application scenarios such as when brittle functional materials (e.g., highly doped silicon for thermoelectric coils [26,27] ) with ultra-low fracture strain apply, the compliance of the helical interconnect is severely restricted and therefore needs to be optimized.…”
Section: D Helical Interconnectsmentioning
confidence: 99%
“…With the continuous development of sensing technology, people have shown great demand for advanced flexible electronic devices [ 1 , 2 ]. Among them, flexible temperature sensors have attracted the attention of many specialists and scholars domestically and abroad in recent years due to their unique properties of high efficiency, seamless contact with the dynamic human body, continuity, and longterm temperature monitoring [ 3 , 4 , 5 ].…”
Section: Introductionmentioning
confidence: 99%