An alternative solder interconnect reliability test to evaluate drop impact performance

Zaal, J.J.M.; Hochstenbach, H.P.; Driel, W.D. van; Zhang, G.Q.

doi:10.1109/ectc.2008.4550125

Cited by 5 publications

(3 citation statements)

References 8 publications

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“…The bump is clamped by a special gripper that induces considerable deformation on the solder sphere, and then load is applied to the pad until failure. The large deformation induced by the grippers on the solder bump makes correlation of results to PCBA level pad-crater complex [18]. The pull angle for both pin and bump pull can be varied to simulate PCBA level loading, but one author has reported no difference in pad strength with change in pull angle, and another has reported an increase in cohesive pad crater over adhesive (see Figure 14) with decrease in pull angle from normal to the plane of the PCB surface [19,20].…”

Section: Literature Reviewmentioning

confidence: 99%

Correlation of Printed Circuit Board Properties to Pad-Crater Defects Under Monotonic Spherical Bend

Gray¹

2023

Preprint

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The restriction of lead in solder has caused a change in base materials used to make electronics—the result of which has been a new failure mode known as pad-crater. The susceptibility of six commercially available printed circuit board (PCB) laminates to pad-crater by spherical bend test was determined. The correlation of PCB laminate tensile properties, Vicker’s hardness (VH) of the resin, and weave dimensions showed an inverse relation between susceptibility to pad-crater and VH. Spherical bend testing of pure G10 laminate showed the orthotropic nature of laminates must be accounted for when modeling spherical bend. Comparison of bare PCB spherical bend test results showed the warp and weft direction have different strain responses for some materials. Comparison of strain energy of printed circuit board assemblies and bare PCB subjected to spherical bend showed the additional stiffness added by the ball grid array is almost identical for PCB laminates with different tensile properties.

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Section: Literature Reviewmentioning

confidence: 99%

Correlation of Printed Circuit Board Properties to Pad-Crater Defects Under Monotonic Spherical Bend

Gray¹

2023

Preprint

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“…Some prior use of the FE method to analyse an interconnect pull test can be found in the literature. Zaal et al 14,15 used FE simulations to calculate the distribution of plastic strain in a solder ball during a pull test. Yeh and Lai 16 used FE calculations with a strain-rate dependent material model to investigate the switch from a ductile failure of the interconnect to a (desired) brittle interfacial failure at the substrate at increasing pull speed.…”

Section: Fe Analysis Need For Numerical Analysismentioning

confidence: 99%

Calculation of optimal jaw geometry for an electronic bond pull test

Symons

Chen

Alton

2013

Proceedings of the Institution of Mechanical Engineers, Part C:

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A bond pull test is used to determine the strength of the bond of an electronic interconnect to a circuit board. A standard test consists of clamping and pulling the interconnect with a pair of microscopic jaws. In a successful test, the maximum pulling force registered by the jaws will be the failure load of the interconnect to circuit board bond. However, if the interconnect itself deforms before the bond has failed, then this would constitute an unsuccessful test. This paper reports on a theoretical analysis of the optimal geometry for gripping of a cylindrical interconnect. Upper and lower-bound plasticity models have been used to determine the jaw proportions that will maximize the load for the deformation of the interconnect and that should, therefore, be most likely to allow successful measurement of the bond strength. This theoretical analysis is compared to 2D and 3D non-linear finite element calculations. The 2D finite element models are axi-symmetric approximations of a pull test on a cylindrical interconnect. 3D finite element models take into account the actual jaw geometry and allow simulation of both clamping and pulling stages. The maximum calculated pull forces for both 2D and 3D simulations are in good agreement with the plasticity theory. Preliminary validation of the theory and finite element results has been accomplished through experimental clamping and pulling tests on cylindrical metal rods.

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“…Drop impact testing of component boards has been widely employed to study the reliability of solder interconnections [10][11][12][13][14][15][16][17][18][19][20][21][22][23]. There are, however, some drawbacks related to the travelling table drop testers.…”

Section: Introductionmentioning

confidence: 99%