Abstract:The restriction of lead in solder has caused a change in base materials used to make electronics—the result of which has been a new failure mode known as pad-crater. The susceptibility of six commercially available printed circuit board (PCB) laminates to pad-crater by spherical bend test was determined. The correlation of PCB laminate tensile properties, Vicker’s hardness (VH) of the resin, and weave dimensions showed an inverse relation between susceptibility to pad-crater and VH. Spherical bend testing of p… Show more
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