1995
DOI: 10.1063/1.358649
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Amorphization and recrystallization of 6H-SiC by ion-beam irradiation

Abstract: Amorphization of 6H-SiC with 200 keV Ge+ ions at room temperature and subsequent ion-beam-induced epitaxial crystallization (IBIEC) with 300 keV Si+ ions at 480 °C have been studied by Rutherford backscattering spectrometry/channeling and transmission electron microscopy analysis. Experimental results on amorphous layer thicknesses have been compared with trim calculations in association with the critical energy density model. Density changes during amorphization have been observed by step height measurements.… Show more

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Cited by 152 publications
(48 citation statements)
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“…[5][6][7] To avoid this problem, the use of ion-beam induced epitaxial crystallization ͑IBIEC͒ has been recently studied. 8 Heera et al have reported the recrystallization of 6H-SiC wafers amorphized by Ge ϩ ion implantation by the use of Si ϩ ion implantation at temperatures as low as 480°C. 8 However, in this work recrystallization is not complete, being the regrowth process stopped by polynucleation near the surface region.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[5][6][7] To avoid this problem, the use of ion-beam induced epitaxial crystallization ͑IBIEC͒ has been recently studied. 8 Heera et al have reported the recrystallization of 6H-SiC wafers amorphized by Ge ϩ ion implantation by the use of Si ϩ ion implantation at temperatures as low as 480°C. 8 However, in this work recrystallization is not complete, being the regrowth process stopped by polynucleation near the surface region.…”
Section: Introductionmentioning
confidence: 99%
“…8 Heera et al have reported the recrystallization of 6H-SiC wafers amorphized by Ge ϩ ion implantation by the use of Si ϩ ion implantation at temperatures as low as 480°C. 8 However, in this work recrystallization is not complete, being the regrowth process stopped by polynucleation near the surface region. To clarify the mechanisms involved, further experiments are needed, including the analysis of amorphous layers obtained by different processes.…”
Section: Introductionmentioning
confidence: 99%
“…Thirdly, along with the normal amorphization as a result of atomic displacement, implants may also cause high stress to accumulate in the region behind the distribution of the damage energy. 20 Last, but not the least, excess carbon implantation may enhance the amorphization process, 25 and therefore the amorphous layer can be thicker than the calculations suggested. The thickness of the deepest implantation range, R p C 2R p , 26 of Al (197 keV) is 0.34 µm, which agrees with our fitted result.…”
Section: 21mentioning
confidence: 81%
“…There is an EPR signal even for the unimplanted wafer. It consists of an isotropic line with zero-crossing g value, go, of 2.0029 + 0.0002, peak-to-peak width, AB , of 0 47 + 0 02 mT and is 9 PP 9 --. slightly asymmetric m shape.…”
Section: Resultsmentioning
confidence: 99%