2018
DOI: 10.1038/s41598-018-31736-4
|View full text |Cite
|
Sign up to set email alerts
|

Aluminum plasmonic waveguides co-integrated with Si3N4 photonics using CMOS processes

Abstract: Co-integrating CMOS plasmonics and photonics became the “sweet spot” to hit in order to combine their benefits and allow for volume manufacturing of plasmo-photonic integrated circuits. Plasmonics can naturally interface photonics with electronics while offering strong mode confinement, enabling in this way on-chip data interconnects when tailored to single-mode waveguides, as well as high-sensitivity biosensors when exposing Surface-Plasmon-Polariton (SPP) modes in aqueous environment. Their synergy with low-… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
7
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
10

Relationship

0
10

Authors

Journals

citations
Cited by 30 publications
(7 citation statements)
references
References 35 publications
0
7
0
Order By: Relevance
“…This work opens the door to the development of modular plasmonic circuit elements that can be seamlessly integrated on off-theshelf photonic waveguides. Note that there has been a recent discussion of CMOS-compatible hybrid plasmonic waveguides 47,48 , which requires using aluminum or copper as metals. We believe that this PIC can be easily fabricated using CMOS-compatible metals such as Cu and Al, which would result in rotator modules with comparable TE-to-TM conversion efficiencies 34 , as well as focuser modules with similar enhancement 38 (see Supplementary Fig.…”
Section: Discussionmentioning
confidence: 99%
“…This work opens the door to the development of modular plasmonic circuit elements that can be seamlessly integrated on off-theshelf photonic waveguides. Note that there has been a recent discussion of CMOS-compatible hybrid plasmonic waveguides 47,48 , which requires using aluminum or copper as metals. We believe that this PIC can be easily fabricated using CMOS-compatible metals such as Cu and Al, which would result in rotator modules with comparable TE-to-TM conversion efficiencies 34 , as well as focuser modules with similar enhancement 38 (see Supplementary Fig.…”
Section: Discussionmentioning
confidence: 99%
“…Since Al and Si are CMOS compatible materials, such hybrid nanoantennas can potentially be integrated into optoelectronic CMOS chips. 40 Note that Al is the key for the fabrication process used in this study, because it serves as a hard mask for the dry etching of pure Si and SiO 2 and as a plasmonic component.…”
Section: ■ Nanofabricationmentioning
confidence: 99%
“…TheSi3N4 waveguide is combined with the plasmonics photonic platform which has high data traffic of 25 Gb/s. The first of its kind of aluminium plasmonic strip integration with a low loss Si3N4 photonics platform has proposed in [100] and is shown in Fig. 5(d).This cointegrated platform is helpful for the biosensing and onchip interconnect applications.…”
Section: Hybrid Integration Of Si3n4 For Various Photonic Integramentioning
confidence: 99%