1999
DOI: 10.1063/1.125228
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AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding

Abstract: An AlGaInP light-emitting diode (LED) with a Au/AuBe/SiO2/Si mirror substrate has been fabricated using wafer bonding. The bonded mirror-substrate LED is capable of emitting luminous intensity of 90 and 205 mcd under 20 and 50 mA injection, respectively. The emission wavelength was found to be independent of the injection current. This feature is attributed to the Si substrate providing a good heat sink.

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Cited by 39 publications
(14 citation statements)
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“…1-3 Therefore, considerable effort has been made to enhance the performance of AlGaInP LEDs, including both the internal quantum efficiency [4][5][6] and the extraction efficiency. [7][8][9][10][11][12][13][14] Hence, current AlGaInP LEDs exhibit a luminous efficiency of as high as 100 lm/W, 14 and have already been adopted in numerous applications. However, in the light of rapid advances in device performance, there are a few studies on the fundamental properties of LED emission, such as spectral width and shape.…”
Section: Spectral Shape and Broadening Of Emission From Algainp Lightmentioning
confidence: 99%
“…1-3 Therefore, considerable effort has been made to enhance the performance of AlGaInP LEDs, including both the internal quantum efficiency [4][5][6] and the extraction efficiency. [7][8][9][10][11][12][13][14] Hence, current AlGaInP LEDs exhibit a luminous efficiency of as high as 100 lm/W, 14 and have already been adopted in numerous applications. However, in the light of rapid advances in device performance, there are a few studies on the fundamental properties of LED emission, such as spectral width and shape.…”
Section: Spectral Shape and Broadening Of Emission From Algainp Lightmentioning
confidence: 99%
“…Meanwhile, some groups suggested a multilayer reflective structure for transparent insulator/Ag forms, such as Si 3 N 4 and SiO 2 , which can improve reflectance performance by engineering optical transport paths [ 12 ]. Nevertheless, the use of resistive parts such as the metal alloy or insulating layer in reflector inevitably generates high power consumption and self-heating issues [ 13 ]. The reflective properties, electrical characteristics and thermal durability of ODRs can be effectively controlled by material selection and reflector architecture.…”
Section: Introductionmentioning
confidence: 99%
“…Heterostructure devices based on III–V compound semiconductors have attracted great attention because of the high mobility and low effective mass of the carriers, the direct band gap, and the tunability of the band gap by modulating components, which combine to enable many applications such as high-electron-mobility transistors (HEMTs), , quantum-well laser diodes, , light-emitting diodes (LEDs), , and photodetectors. However, traditional fabrication of III–V semiconductor heterostructures present significant technological challenges because of the lattice-constant mismatch with other substrates and the generation of defects during the processes of direct growth and wafer bonding. To address these challenges, an epitaxial layer transfer technique was introduced to heterogeneously integrate III–V semiconductor nanomembranes onto arbitrary substrates, whereby, the bonding at heterointerfaces with a large lattice mismatch is facilitated by van der Waals forces during the transfer printing processes. This technique has enabled the fabrication of various III–V heterostructure devices on Si and flexible substrates, including complimentary metal-oxide-semiconductor field-effect transistors (MOSFETs) based on InGaSb and InAs on Si substrates, flexible MOSFETs with InAs on polyimide substrates, spin-FETs with InAs HEMT structures on Si substrates, and broadband photodetectors based on InGaAs and Si heterojunctions .…”
Section: Introductionmentioning
confidence: 99%