“…Moreover, polyimide as an alignment layer material requires a baking stage with heat treatments up to 250 °C, and this can damage sensitive electronic parts of the fabricated display. Several alternative methods were developed to overcome these disadvantages like ultraviolet (UV) photoalignment, Kaufman ion beam irradiation, plasma beam irradiation, atmospheric pressure plasma jet treatment, step by step plasma enhanced chemical vapor deposition (PECVD) and treatment with plasma flux, oblique vapor and ion‐beam sputter deposition, etc. All these alternative techniques, except oblique evaporation, use the approach of a two step fabrication method; during the first step alignment, layer material is deposited (polyimide, a‐C:H, a‐Si:H, etc.)…”