2019
DOI: 10.1039/c9ra03090e
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Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity

Abstract: Heat dissipation is a critical issue in high-performance electronics, which needs to be solved, and an electronic paste is a good choice to solve this issue.

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Cited by 12 publications
(4 citation statements)
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References 33 publications
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“…FTIR spectroscopy was used to discriminate and identify the biomolecules of olive leaf. FTIR has been utilized by numerous researchers to analyze a variety of materials [ 23 , 24 , 25 ]. By looking at FTIR spectra based on stretching or bending vibration of specibonds, FTIR spectroscopy can reveal information on intermolecular interaction [ 25 , 26 ].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…FTIR spectroscopy was used to discriminate and identify the biomolecules of olive leaf. FTIR has been utilized by numerous researchers to analyze a variety of materials [ 23 , 24 , 25 ]. By looking at FTIR spectra based on stretching or bending vibration of specibonds, FTIR spectroscopy can reveal information on intermolecular interaction [ 25 , 26 ].…”
Section: Resultsmentioning
confidence: 99%
“…FTIR has been utilized by numerous researchers to analyze a variety of materials [ 23 , 24 , 25 ]. By looking at FTIR spectra based on stretching or bending vibration of specibonds, FTIR spectroscopy can reveal information on intermolecular interaction [ 25 , 26 ]. In Figure 4 , the olive leaf’s FTIR spectrum is shown.…”
Section: Resultsmentioning
confidence: 99%
“…There are some reports indicating that depositing nanosilver on the surface of carbon nanotubes can enhance the electronic conductivity and thermal conductivity of silver paste. Li et al [ 20 ] synthesized Ag-MWCNT composite materials through chemical methods, which can improve the thermal conductivity of silver paste from 0.73 W/m·K to 0.96 W/m·K. Although the prepared composite material Ag-MWCNTs can improve the thermal conductivity of paste, the electrical resistivity of the paste has not been tested; moreover, the improvement in thermal conductivity is not significant, which cannot meet the requirements in microelectronic products.…”
Section: Introductionmentioning
confidence: 99%
“…Typical thermal conductive fillers include metals (Ag, Al, etc.) [ 14 ], carbon-based materials (carbon nanotube, graphene, etc.) [ 15 , 16 , 17 ], and ceramics (Al 2 O 3 , BN, etc.)…”
Section: Introductionmentioning
confidence: 99%