Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites

Abstract

In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials.

DIW-Printed Thermal Management PDMS Composites with 3D Structural Thermal Conductive Network of h-BN Platelets and Al2O3 Nanoparticles

“…To meet the thermal conductive requirement, a high filler loading would usually be needed to fabricate an adequate thermal conductive network. However, the quest for optimal thermal conductivity often necessitates high filler loadings, which can lead to a reduction in the polymer matrix’s mechanical integrity, dielectric properties, and rheological behavior [ 16 , 17 , 18 ]. This underscores the importance of developing strategies that promote efficient bonding between thermal conductive fillers and the polymer matrix while simultaneously reducing the overall filler content, a delicate balance crucial for the successful integration of these materials into electronic devices.…”