1988
DOI: 10.1007/bf02652149
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Ag/Ai schottky contacts on n-InP

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1989
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Cited by 17 publications
(3 citation statements)
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“…[6 -14] Dunn et al [6] fabricated the Ag/Al/InP structure and obtained an effective barrier height of 0.4 eV for the as-deposited sample. They found that the barrier height increased as much as 0.26 eV resulting in beff ≈ 0.65 eV by annealing at temperatures between 400 and 500…”
Section: Introductionmentioning
confidence: 99%
“…[6 -14] Dunn et al [6] fabricated the Ag/Al/InP structure and obtained an effective barrier height of 0.4 eV for the as-deposited sample. They found that the barrier height increased as much as 0.26 eV resulting in beff ≈ 0.65 eV by annealing at temperatures between 400 and 500…”
Section: Introductionmentioning
confidence: 99%
“…Many researcher proposed some method to improve the electrical characteristic, they including PH3 plasma treatments, [9] growing a thin P3N5 film, [10] a POXNyHZ film,[11] a InSb film, [12] an interfacial oxide layer, [13][14][15][16] low temperature deposition techniques [ 17]or stacked metal structure Ag/Al [18], Pt/Al [19,20], and Ni/Ai/Ni [21] . All the reports showed higher effective barrier height than that of conventional single metal/n-InP diode.…”
Section: Introductionmentioning
confidence: 99%
“…Shi and Anderson 8 applied a low-temperature ͑77 K͒ deposition method for metals/n-InP contacts providing an ultrahigh barrier of 0.96 eV. Larger barriers were also achieved in the case of Ag/Al/n-InP ͑0.65 eV͒ 9 and Pt/Al/n-InP ͑0.74 eV͒ 10 structures.…”
Section: Introductionmentioning
confidence: 99%