Advanced resist processing for thick photoresist applications

Cullmann, E.; Loechel, B.; Maciossek, A.; Rothe, Martina

doi:10.1016/0167-9317(95)00307-x

Cited by 4 publications

(3 citation statements)

References 7 publications

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“…A positive Novolak photoresist [5,6] allows the fabrication of resist moulds up to 100 µm thickness in one UV exposure with an aspect ratio near 10. For higher thicknesses several successive exposures and developments are necessary, which imposes a limit to a good resolution.…”

Section: Introductionmentioning

confidence: 99%

Potentialities of a new positive photoresist for the realization of thick moulds

Conedera

Goff²,

Fabre

1999

J. Micromech. Microeng.

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The fabrication of MEMS by using the technique of electrodeposition inside resist moulds has known a large development in recent years. Recently, Clariant has produced a new positive photoresist, AZ 9260 ® (500 cps), aimed at the realization of such thick moulds.In this paper, we describe the excellent characteristics of this product through the use of our original method to control technological parameters. The most important feature of AZ 9260 ® photoresist is its good transparency. Current results, using a standard mask aligner, give a good aspect ratio (height-width) of up to 15 easily for 100 µm thick moulds and up 20 occasionally and our measurement method of transparency predicts the potential realization of mould thickness up to 150 µm in one UV exposure.

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Section: Introductionmentioning

confidence: 99%

Potentialities of a new positive photoresist for the realization of thick moulds

Conedera

Goff²,

Fabre

1999

J. Micromech. Microeng.

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“…• Positive photoresists using conventional equipment to realize three-dimensional microstructures by galvanic moulding [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

“…Results obtained with the use of positive photoresist [6] show that we can obtain thick layers (up to 10:1 aspect ratio) with a limit resolution depending on the resist thickness in one coat or several coats with single exposure or multiple exposure. With this method, no expensive special equipment is required.…”

Section: Introductionmentioning

confidence: 99%

A simple optical system to optimize a high depth to width aspect ratio applied to a positive photoresist lithography process

Conedera¹,

Fabre²,

Dilhan³

1997

J. Micromech. Microeng.

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The fabrication of micro electro mechanical systems by electrodeposition inside resist moulds has provided much interest in recent years. In this paper, we propose a method to optimize the lithography process of a thick positive photoresist. This technique is based on the variation of transparency of the photoresist during exposure. During exposure the absorption of the light-sensitive compound decreases due to its conversion into indene carboxylic acid. A very good aspect ratio (height:width) of up to 10:1 and high edge steepness (88 • ) has been obtained from one coat and one UV exposure.

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A dedicated micromachining technology for high-aspect-ratio millimetre-wave circuits

Saint-Etienne

Pons

Blasquez

et al. 1998

Sensors and Actuators A: Physical

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Advanced resist processing for thick photoresist applications

Cited by 4 publications

References 7 publications

Potentialities of a new positive photoresist for the realization of thick moulds

Potentialities of a new positive photoresist for the realization of thick moulds

A simple optical system to optimize a high depth to width aspect ratio applied to a positive photoresist lithography process

A dedicated micromachining technology for high-aspect-ratio millimetre-wave circuits

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