2017 IEEE Transportation Electrification Conference and Expo (ITEC) 2017
DOI: 10.1109/itec.2017.7993332
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Adoption of wide bandgap technology in hybrid/electric vehicles-opportunities and challenges

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Cited by 26 publications
(14 citation statements)
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“…Si has an E c = 20V.µm −1 whereas SiC and GaN have an [53]. This means for the same voltage rating WBG devices can be a lot smaller, or for the same size the voltage rating of a WBG semiconductor can be a lot higher [54,50].…”
Section: Methodsmentioning
confidence: 99%
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“…Si has an E c = 20V.µm −1 whereas SiC and GaN have an [53]. This means for the same voltage rating WBG devices can be a lot smaller, or for the same size the voltage rating of a WBG semiconductor can be a lot higher [54,50].…”
Section: Methodsmentioning
confidence: 99%
“…The wide band gap aspect to these materials denoted that they have a large eV gap between their valence and conducting bands. Table 5.1 shows values of band gaps for various semi-conductors with a WBG material having an energy gap higher than 3eV [50]. From the list of semi-conductors silicon has been widely used as the main material for power switches such as: power diodes, thyristors, metal-oxide semiconductor field effect transistor (MOSFET) and insulated gate bi-polar transistors (IGBT's) [51].…”
Section: Using Wide Band Gap Semi-conductorsmentioning
confidence: 99%
“…Table 4 and Table 5 show several manufacturers that are currently using WBG devices for OBC application. Although WBG devices currently have a higher cost, it is expected that the price will decrease as the production rises [143], [144]. As an alternative solution, some companies, like Texas Instruments, combine SiC with Si technologies to reduce the cost while improving the overall performance [119].…”
Section: B Wbg Devicesmentioning
confidence: 99%
“…• No Q rr period which translates to their capability of switching at high frequencies Some of the challenges associated with GaN are the high electromagnetic interference (EMI), gate ringing and oscillation due to the parasitics rising from the power circuit, device packaging and the device control loop. The dead-time resulting from the higher frequency reduces voltage significantly leading to power loss [37]. With the smaller switching times, the common mode and differential mode noise associated with GaN devices increase accordingly [38].…”
Section: A Device Comparisonmentioning
confidence: 99%