Adhesion Promotion Technology for Semi-Additive Process

Chueh, Bor Han; Wu, Chien-Tung; Li, C.; Tanabe, Katsuaki

doi:10.1109/impact.2008.4783874

Cited by 2 publications

(3 citation statements)

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“…The microscopic pits on the epoxy resin were formed by the oxidation of the epoxy resin and removal of the SiO 2 particles during the adhesion promotion process. The formed microscopic pits were utilized as anchors for the Cu trace (Chueh et al, 2008).…”

Section: Methodsmentioning

confidence: 99%

“…It is thus clear that the peel strength was very strongly affected by the surface roughness. It is known that, in the semi-additive processing of organic substrates, high surface roughness and coral-like morphology of the dielectric materials result in higher interfacial fracture energy (Huang et al, 2010;Chueh et al, 2008). In Figure 8, the open circle representing the results of the 908 peel test is located slightly under the fit line of the peel strength determined using the SAICAS test.…”

Section: Peel Strength Between Copper Trace and Epoxy Resinmentioning

confidence: 96%

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Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Huh

Kim²,

Kim³

2014

Circuit World

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Purpose -The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 908 peel test. Design/methodology/approach -In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system. Findings -The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm 2 1 ) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.Research limitations/implications -It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro-and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials. Originality/value -From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.

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Section: Methodsmentioning

confidence: 99%

Section: Peel Strength Between Copper Trace and Epoxy Resinmentioning

confidence: 96%

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Huh

Kim²,

Kim³

2014

Circuit World

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“…In view of the shortcomings of traditional production methods, some scholars have made some improvements in production methods, such as modified semi-additive method (Chueh et al , 2008; Feng et al , 2013) and modified full additive method (He et al , 2017). The main difference between modified semi-additive method and semi-additive method is that modified semi-additive method uses a copper-clad substrate, and thickness of surface copper needs to be reduced to 3–5 μm before production of PCB fine lines, while using semi-additive method to produce PCB fine lines, electroless copper plating is performed directly on the insulating substrate.…”

Section: Introductionmentioning

confidence: 99%

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Wen

Chen

et al. 2021

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Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

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Adhesion Promotion Technology for Semi-Additive Process

Cited by 2 publications

References 0 publications

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

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