Currently, average roughness (Ra), is the parameter specified for controlling surface quality. The influence of surface averageThe increased functionality of today's advanced electronics, such roughness (Ra) does not correlate well to peel strength between as multi-function mobile equipment, is driven by semiconductor epoxy substrates and plated copper. In this article, we will use 3-D technology development. The added functionality of semiconductor roughness parameters to provide a better insight into the relationship and passive devices increase circuit density and decrease the between peel strength and surface roughness. available assembly space in the device. Packaging substrates are controlled by semiconductor trends. As semiconductor chip EXPERIMENT performance improves, the substrates and packaging technologies must keep pace.
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